SECTION MANAGER, Process Engineering (Photolithography & Etch)

Job Summary:

onsemi is currently seeking a Section Manager to lead the process engineering team in wafer fabrication processes. This individual will leverage their knowledge, skills, and, most importantly, energy and willingness to learn to take on challenges and support onsemi’s technology development and engineering initiatives across multiple areas. This position reports to the Senior Manager, Process Engineering.

Key Duties and Responsibilities

• Lead and manage the process engineering team, providing engineering support to the manufacturing line to achieve best-in-class quality, yield, cost, and cycle time.
• Provide technical leadership and timely solutions for day-to-day manufacturing issues.
• Lead the process engineering team in optimizing wafer fabrication processes using Design of Experiments (DOE), statistical analysis, and data-driven methodologies to improve yield, cost, quality, and cycle time.
• Analyze failing wafers with cross-functional teams to identify root causes and implement corrective actions, including close collaboration with suppliers and customers.
• Lead and participate in cross-functional (local and global) teams on new technology development, process transfers, and new product introductions.
• Implement error-proofing strategies for both processes and equipment to eliminate human- and machine-related defects.
• Establish and maintain effective process controls, work procedures, and technical documentation (including work instructions and specifications).
• Drive continuous improvement initiatives for equipment, materials, metrology, and processes in coordination with suppliers, engineering teams, and operations.
• Identify, evaluate, and implement new technologies, tools, and innovative manufacturing solutions.
• Implement and advance metrology and inspection techniques to enhance process monitoring and control.
• Manage equipment, process, and vendor qualifications, including capital project planning and execution.
• Collaborate closely with Operations, Engineering, and external vendors to ensure timely and effective project execution.
• Perform other duties as assigned.

Competencies

The ideal candidate should demonstrate the following:

• Knowledge of electronics, semiconductor technology, or solid-state physics is preferred.
• Proficiency in Design of Experiments (DOE) and statistical process control (SPC) methodologies are essential.
• Strong project management skills.
• Self-motivated, independent, and hands-on approach.
• Strong analytical and interpersonal skills.
• Excellent written and verbal communication skills.
• Ability to work independently, as well as to form and lead teams.
• Ability to manage multiple projects and prioritize effectively.
• Experience in device failure analysis (e.g., SEM, EDX, SIMS, FIB, AFM) and device physics is strongly desired.
• Ability to thrive in a dynamic environment while supporting and coordinating multiple projects simultaneously.

Requirements

• A minimum of a Bachelor's degree in Chemical, Physics, Electrical, Electronics, Mechanical, or Materials Science Engineering is required.

At least 5 years of experience in wafer fabrication, specifically in photolithography and etching processes, is highly preferred.