Quantum Superconducting Interconnect Integration Engineer

GlobalFoundries Fab8 is seeking an experienced R&D interconnect and interposer integration engineer to become part of our Quantum Advanced Packaging team. The primary responsibility of this position is to own development and integration of cryogenic, superconducting interconnect and interposer technologies enabling scalable quantum system integration.

About GlobalFoundries

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Job Summary

GlobalFoundries Fab8 is seeking an experienced R&D interconnect and interposer integration engineer to become part of our Quantum Advanced Packaging team.  The primary responsibility of this position is to own development and integration of cryogenic, superconducting interconnect and interposer technologies enabling scalable quantum system integration.

Essential Responsibilities

• Lead development of superconducting interconnect and interposer integration processes (e.g., Nb, Al, In, superconducting liners, redistribution layers).
• Develop 2.5D and 3D cryogenic interposer architectures for quantum systems.
• Define routing, metallization, and integration schemes optimized for:
  • Low-loss RF/microwave signal propagation
  • Minimal thermal leakage
  • Cryogenic reliability
• Own end-to-end integration of interposer and interconnect flows across:
  • Wafer-level processes (RDL, TSV/TOV, via formation)
  • Die-level integration (bump, bonding, assembly interfaces)
• Drive process integration planning to enable new capabilities and prototyping across programs.
• Architect and integrate multi-die quantum packaging solutions, including:
  • Qubit die + control electronics
  • Superconducting interposers
• Support chiplet-style and system-level integration for scalable quantum systems.
• Translate system-level requirements into interconnect density, pitch, and routing specifications.
• Enable early-stage prototyping lots, ensuring smooth execution through fab and assembly lines.
• Support transition to manufacturable, scalable flows.
• Support integration strategies to improve yield and manufacturability and reduce cost/cycle time.
• Identify and drive understanding of failure modes, including:
  • Interconnect degradation
  • Cryogenic stress-induced defects
  • Interface reliability issues
• Lead root-cause analysis and corrective actions.
• Collaborate with device and test teams to ensure interconnect solutions:
  • Preserve qubit performance (coherence, noise)
  • Meet cryogenic electrical and thermal constraints
• Support system-level validation and characterization at cryogenic conditions
• Develop expertise in:
  • Superconducting materials and interfaces
  • Low-temperature material behavior and integration challenges
• Work with equipment and suppliers to define process/tool requirements for:
  • Superconducting metallization
  • Interposer fabrication
  • Advanced 3DHI integration
• Interface across:
  • Device / qubit teams
  • Assembly, bump, and TSV integration teams
  • Reliability and modeling teams
• Collaborate with OSATs, suppliers, and research partners to co-develop interconnect technologies.
• Drive next-generation interconnect scaling (pitch, density, materials) aligned with quantum system scaling needs
• Contribute to advanced packaging roadmap (APPC / cryo 3DHI).
• Identify and evaluate emerging interconnect technologies and integration schemes.
• Generate:
  • Integration flow documentation
  • Process specs and design rules
• Provide technical reports and progress updates to internal and external stakeholders.
• Contribute to IP, publications, and conference outputs.

Other Responsibilities

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. 
• Take part in hiring of other Advanced Packaging team members in Singapore. 
• Mentor and guide new hires to assume their roles and responsibilities. 
• Other duties as assigned by manager. 

Required Qualifications

• Education – Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program. 
• MS degree with at least 10 years of prior related work experience. 
• Must have at least an overall 3.0 GPA and proven good academic standing. 
• Language Fluency - English (Written & Verbal). 
• Travel - Up to 20%. 

Preferred Qualifications

• Education – PhD education level preferred with at least 8 years of prior related work experience. 
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.  
• Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.   
• Strong written and verbal communication skills.   
• Strong planning & organizational skills. 

Additional Information

GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard. As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities. All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.

Expected Salary Range

$118,000.00 - $210,000.00

The exact Salary will be determined based on qualifications, experience and location.