Company Overview
Group/Division
Job Description/Preferred Qualifications
The Product Line Manager (PLM) Director for Advanced Packaging & Metrology will drive product strategy, lifecycle management, and market analysis for next-generation semiconductor packaging and metrology solutions. This hybrid role blends technical depth with market insight, requiring leadership in both product management and strategic marketing and will be responsible for defining product strategy, driving customer adoption, and managing the full lifecycle of Advanced Packaging products. The ideal candidate will have extensive experience in advanced packaging, metrology, or inspection technologies, and a proven ability to lead and build cross-functional teams to deliver innovative solutions that meet evolving customer needs.
Responsibilities will include:
Product Strategy & Lifecycle Management
Define and own the product roadmap, including technical direction, feature prioritization, and strategic decisions on architecture and specifications.
Manage the full product lifecycle from concept through end-of-life, ensuring alignment with division goals and objectives.
Oversee project planning, scope, schedule, budget, and resource allocation.
Own the product line’s P&L, including revenue, margin, and cost structure.
Drive Balanced Scorecard metrics: cost, growth, customer satisfaction, and innovation.
Analyze market trends and technology inflections (e.g., 2.5D/3D integration, hybrid bonding, backside power delivery, chiplet architectures, fan-out packaging, co-packaged optics).
Conduct strategic market studies and competitive analysis to guide investment decisions and identify growth opportunities.
Evaluate and prioritize customer feature requests; translate market needs into actionable development plans.
Assess emerging technologies and forecast their growth potential.
Customer & Relationship Management
Build and maintain strong relationships with customers, understanding their requirements and expectations.
Drive product adoption and penetration in advanced packaging and metrology segments.
Lead customer engagement strategies through Field Marketing and Applications Engineering.
Act as the primary point of contact between customers and the division, supporting pre-sales and after-sales projects.
Cross-Functional Leadership & Global Collaboration
Collaborate with R&D, Engineering, Sales, Marketing, Operations, and global teams to ensure successful product execution.
Facilitate clear communication among project teams, stakeholders, and senior management, providing regular updates on status, risks, and mitigation plans.
Champion product vision internally and externally.
Engage with a global installed base, requiring approximately 30–40% business travel (domestic and international), based on business needs.
Minimum Qualifications
Required Qualifications
Bachelor’s, Master’s, or PhD in Engineering, Physics, Materials Science, or related technical field.
10+ years of experience in product management, applications engineering, or technical marketing, preferably in the semiconductor or advanced packaging/metrology industry.
Deep understanding of advanced packaging manufacturing processes and equipment (including 2.5D/3D packaging, hybrid bonding, chiplet architectures, fan-out packaging, CoWoS, SOIC, HBM and related metrology or inspection technologies).
Experience with PLM tools, financial modeling, and customer engagement strategies.
Proven ability to develop and execute market strategies and product roadmaps.
Knowledge of wafer inspection technologies and tools.
Strong analytical, communication, and leadership skills.
Willingness and ability to travel internationally (30–40%).
Preferred Qualifications
Experience working with global teams and diverse customer bases.
Ability to translate technical concepts into business value.
Familiarity with competitive analysis and strategic market development for advanced packaging products.
We offer a competitive, family friendly total rewards package. We design our programs to reflect our commitment to an inclusive environment, while ensuring we provide benefits that meet the diverse needs of our employees.
KLA is proud to be an equal opportunity employer
Be aware of potentially fraudulent job postings or suspicious recruiting activity by persons that are currently posing as KLA employees. KLA never asks for any financial compensation to be considered for an interview, to become an employee, or for equipment. Further, KLA does not work with any recruiters or third parties who charge such fees either directly or on behalf of KLA. Please ensure that you have searched KLA’s Careers website for legitimate job postings. KLA follows a recruiting process that involves multiple interviews in person or on video conferencing with our hiring managers. If you are concerned that a communication, an interview, an offer of employment, or that an employee is not legitimate, please send an email to [email protected] to confirm the person you are communicating with is an employee. We take your privacy very seriously and confidentially handle your information.
KLA Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about KLA and has not been reviewed or approved by KLA.
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Retirement Support — Retirement offerings include a 401(k) plan with company matching and financial planning support. Student debt assistance and related financial benefits reinforce long-term savings and security.
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Equity Value & Accessibility — Ownership programs include an Employee Stock Purchase Plan and broad-based RSU participation that extend equity beyond a narrow group. These elements complement competitive pay and bonuses to strengthen total rewards.
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Leave & Time Off Breadth — Time-off programs span paid time off, paid company holidays, and paid volunteer time. Family care and bonding leave and back-up care services add flexibility during life events.
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What We Do
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward.
