• Collaborate with design, test, reliability, and packaging teams to troubleshoot issues and support product development.
• Perform design rule checks and product validation to ensure robust product design; defining new product process criteria and GDS checks for tape-out.
• Develop comprehensive product characterization and testing plans with R&D and foundry teams to ensure products performance meets requirements.
• Ensure product roadmap success by identifying improvement opportunities through physical/electrical failure analysis, process optimization and defect reduction.
• Access pixel performance through statistical analysis of electrical and functional metrics at both wafer- and chip-level testing.
• Work with quality engineers to address customer complaints, implement corrective actions, and track improvements after solution implemented to minimize field returns.
• Collaborate with different foundries to optimize processes, including silicon, color and packaging processes, enhancing overall product performance.
• Work with testing engineers to develop, verify, and release CP and FT testing programs; perform sensors validation on manual testing board.
• Improve product yield by process and layout optimization; analyze yield data and drive improvement actions.
• Define production testing specifications, ensure product yield on target, and reduce process and test fluctuating issue for timely ramp-up.
• Ensure products meet AEC Q-100 standards and other relevant automotive specifications.
• Work with foundries to drive continuous yield enhancements, continuous improvement plans (CIP), and best-known-methods (BKM) updates throughout the product lifecycle.
• Deliver cutting-edge CIS solutions for the automotive industry.
• Support IC-design clients in ramping up the new tape out (NTO) products, sustaining yields for high‐volume production products and improving product quality and functionality.
• Design rules checks and layout review to ensure robust product design.
• Experience in raw materials, production processes, quality control, costs, and techniques for maximizing the effective manufacture of products.
• Experience in cross-team work for joint project development; coordination with client, Fab and support teams to identify improvement opportunities and implement solutions.
• Monitor the CP and FT testing result to gate and resolve issues in mass production.
• Experience in physical failure analysis techniques, such as TEM, EDX, and OBIRCH.
Skills Required
- Master's degree in Electrical Engineering, Physics, Material Science, or a related field
- At least one year of experience in product engineering
- Experience supporting IC-design clients with new tape-out product ramp-up, high-volume production yield sustainment, and product quality and functionality improvement
- Experience performing design rule checks and layout reviews
- Experience with raw materials, production processes, quality control, costs, and manufacturing effectiveness techniques
- Experience coordinating cross-team joint project development with clients, fabs, and support teams
- Experience monitoring CP and FT testing results and resolving mass-production issues
- Experience with physical failure analysis techniques including TEM, EDX, and OBIRCH
What We Do
Founded in 1995, OMNIVISION has been at the leading-edge of technology, developing and delivering advanced digital imaging, analog, and touch & display solutions for multiple applications across several industries. With more than 3,000 employees worldwide and over 13 billion products shipped, OMNIVISION is a well-known global fabless semiconductor company. Our products can be found everywhere in people’s lives including mobile phones, security & surveillance, automotive, computing, medical, and emerging applications. Across these segments, OMNIVISION’S award-winning technology enables a smoother human/machine interface in many of today’s commercial devices. In this way, OMNIVISION delivers solutions that put its customers at the leading edge of technology. Whether it be developing the first mobile handset camera accessory in 2002, introducing the world’s smallest NTS camera in 2006 or launching PureCel CMOS image sensors in 2013, our dedication to providing reliable, innovative imaging and sensing solutions continue to be the primary aim. The company has recorded numerous industry firsts in its relentless quest for technology breakthroughs that deliver #InfiniteIngenuity: • Guinness World Record for the World's Smallest Commercially Available Image Sensor (OV6948) in 2019. In 2021, it beat its own record with the new OH0TA OVMed® • First to commercialize backside illumination technology in 2007 (OmniBSI™) • Industry's 1st to deploy the most mature LED Flicker Mitigation (LFM) solution in mass production for multiple automotive applications • Automotive industry leader with HALE, our HDR & LFM Engine combination algorithm • Developer of Nyxel® near-infrared technology with by far the best quantum efficiency in CMOS near-infrared imagine • Creator of CameraCubeChip™, the industry’s 1st wafer-level camera modules • First and only global shutter image sensors with cybersecurity, for ADAS and autonomous vehicles • First to introduce RBG-Ir technology to medical
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