The Role
Own product change control and quality for SiC power semiconductor products across fab, test, assembly and manufacturing. Lead risk assessments, excursion responses (8D), root-cause analysis, yield improvement and cost-reduction projects. Maintain BOM/PLM data in Arena, implement statistical outlier methods (SPAT/DPAT/GDBN), and standardize processes across Torrance and Pune engineering sites.
Summary Generated by Built In
Key Responsibilities and Duties
- Own change control administration for released products, including fab, test, assembly and other manufacturing process changes
- Drive risk assessment, customer notification, and change validation
- Monitor circuit probe (CP), known good die test (KGD), and final test (FT) operations to identify excursions and contain affected lots quickly
- Develop non-conforming product reports, including root-cause analysis, risk assessment, and disposition
- Identify and resolve recurring product and process issues
- Support automated yield reporting and alerts to catch low-yield trends early
- Prioritize and execute the highest-ROI cost reduction and yield improvement projects; report progress against annual savings goals
- Manage SBL/SYL quality limits and hold-lot disposition
- Implement SPAT, DPAT, and GDBN methods to eliminate statistical outliers
- Lead quality excursion response using 8D methodology and structured problem solving
- Own and maintain the hierarchical BOM structure in Arena PLM
- Maintain specifications and work instructions; help standardize methodology across the Torrance and Pune engineering sites
- Originate and contribute to proactive, higher-scope strategic initiatives such as alternate-site or alternate-flow qualification.
- Master’s degree in electrical engineering, Materials Science, Semiconductor/Microelectronics Engineering, or a related technical field
- 3+ years of experience in semiconductor products, process, or test engineering, ideally spanning fab, wafer test/KGD, and assembly
- Experience with Silicon Carbide (SiC) or other power semiconductor devices strongly preferred
- Working knowledge of statistical process control and outlier-detection methods (e.g., SPC, SPAT/DPAT, GDBN)
- Experience with structured root-cause and corrective action methodologies (8D or equivalent)
- Familiarity with PLM/BOM systems (Arena PLM or similar) and hierarchical BOM structures are a strong plus
- Comfortable working with production and yield data; Excel or scripting skills (Python, JMP/JSL) a plus
- Strong written and verbal communication skills; able to collaborate closely with the Torrance, CA PE team across time zones
- Self-directed and comfortable operating in a newly established team, helping define processes as the team scales
Skills Required
- Master's degree in electrical engineering, Materials Science, Semiconductor/Microelectronics Engineering, or related technical field
- 3+ years experience in semiconductor products, process, or test engineering (fab, wafer test/KGD, assembly)
- Experience with Silicon Carbide (SiC) or other power semiconductor devices
- Working knowledge of statistical process control and outlier-detection methods (SPC, SPAT/DPAT, GDBN)
- Experience with structured root-cause and corrective action methodologies (8D or equivalent)
- Familiarity with PLM/BOM systems (Arena PLM or similar) and hierarchical BOM structures
- Comfortable working with production and yield data; Excel or scripting skills (Python, JMP/JSL)
- Strong written and verbal communication skills; ability to collaborate across time zones
- Self-directed; ability to define processes in a newly established team
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The Company
