The Opportunity
For nearly a decade, Intel's Neuromorphic Computing Lab-together with a global ecosystem of 250+ research groups-has explored architectures, algorithms, and software inspired by the brain's extraordinary efficiency, scalability, and adaptability. Our Loihi series of research chips pioneered event-driven, sparse, and massively parallel neuro-inspired processing, fueling over 100 peer-reviewed publications that validate the promise of this novel approach.
Now, we're entering an exciting new chapter: transforming these breakthroughs into real-world products that will power the coming era of physical AI systems-beyond the reach of GPUs and mainstream AI accelerators.
If you are passionate about pushing the boundaries of computing, from transistor-level innovation to software abstractions, join us. Help define the next wave of AI technology that harnesses the proven advantages of Intel's neuromorphic computing technology with the versatility demanded by modern AI workloads.
Position Overview
We are seeking a senior product development engineer to lead the DFT/DFX strategy for Intel's neuromorphic silicon program. This role offers a unique opportunity to help define manufacturing and test methodologies for groundbreaking computing architectures that push beyond the limits of traditional AI systems.
As the DFT/DFX lead in Intel's neuromorphic silicon team, you will architect and drive innovative test, debug, and reliability solutions that enable high-quality, high-volume production. Loihi's use of asynchronous circuits and advanced integration technologies presents challenges that cannot be addressed by conventional DFX approaches, creating opportunities to develop new methodologies and influence the future of neuromorphic computing.
Working closely with design architects and circuit experts, you will define test strategies, implement fault coverage solutions, and ensure robust operation across the product lifecycle. An openness to learning new technologies and methodologies, such as asynchronous design techniques and using agentic tools for development and debug is essential.
Responsibilities
• Architect a complete DFT solution at the SoC level, compiling the requirements of both synchronous and asynchronous designs.
• Lead the flow-development for scan-insertion and compression at partition and SoC levels.
• Build a scalable framework spanning EDA tools, RTL and emulation models to generate high-quality test vectors and validate them pre-silicon.
• Collaborate with designers to drive DFT/DFD/DFM features to ensure manufacturing readiness to support HVM.
• Lead silicon power-on, enabling tester content, debugging failures and maintaining any tools/flows that are developed.
Minimum qualifications
• Bachelors and 6+ years OR Masters and 4+ years of hands-on DFT experience from architecture to silicon bring-up.
• 6+ years of experience of architecting the entire DFT stack including scan insertion, compression and ATPG vector generation.
• 4+ years of direct ownership of IP and SoC-level scan constructs, e.g. boundary scan (JTAG), TAP, BIST/MBIST.
• 1 year of experience in debugging post-silicon and driving circuit changes for testability and reliability improvements.
Preferred qualifications
• Experience in custom ASICS or AI/ML accelerator design.
• Experience in post-silicon bin split, die-level cherry picking (DLCP) and fault grading.
• Strong System-Verilog/System-C/OOP background with pre-silicon verification experience.
• Experience in test time reduction techniques on automatic test equipment (ATE).
• Experience in asynchronous architectures and circuits.
• 1+ year of experience using AI tools for setting up tool flows, debugging and improving overall productivity.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:US, Arizona, Phoenix, US, California, Folsom, US, California, Santa Clara, US, Texas, AustinPosting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $141,910.00-269,100.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor’s degree and 6+ years of hands-on DFT experience, or Master’s degree and 4+ years of hands-on DFT experience
- 6+ years architecting the complete DFT stack, including scan insertion, compression, and ATPG vector generation
- 4+ years owning IP- and SoC-level scan constructs, such as boundary scan, JTAG, TAP, BIST, or MBIST
- 1+ year debugging post-silicon issues and driving circuit changes for testability and reliability improvements
- Experience with custom ASICs or AI/ML accelerator design
- Experience with post-silicon bin split, die-level cherry picking, and fault grading
- Strong SystemVerilog, SystemC, and object-oriented programming background with pre-silicon verification experience
- Experience reducing test time on automatic test equipment
- Experience with asynchronous architectures and circuits
- 1+ year using AI tools to set up tool flows, debug, and improve productivity
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
Intel Insights
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