Product Design Engineering Intern (Summer 2027)

Posted 13 Days Ago
Be an Early Applicant
San Francisco, CA, USA
In-Office
Internship
Artificial Intelligence • Hardware • Software
HP’s new AI innovation lab focused on building an intelligent ecosystem of devices and services for the future of work.
The Role
Design and integrate manufacturable hardware products from architecture and prototyping through production ramp. Responsibilities include CAD modeling, subsystem integration, tolerance analysis, manufacturing feasibility, prototype builds, PCB integration, assembly-process design, design validation, and technical documentation. The intern will collaborate with industrial design, electrical engineering, manufacturing partners, contract manufacturers, and vendors in a fast-paced, hands-on environment.
Summary Generated by Built In

Who We Are

HP IQ is HP’s new AI innovation lab. Combining startup agility with HP’s global scale, we’re building intelligent technologies that redefine how the world works, creates, and collaborates.

We’re assembling a diverse, world-class team—engineers, designers, researchers, and product minds—focused on creating an intelligent ecosystem across HP’s portfolio. Together, we’re developing intuitive, adaptive solutions that spark creativity, boost productivity, and make collaboration seamless.

We create breakthrough solutions that make complex tasks feel effortless, teamwork more natural, and ideas more impactful—always with a human-centric mindset.

By embedding AI advancements into every HP product and service, we’re expanding what’s possible for individuals, organisations, and the future of work.

Join us as we reinvent work, so people everywhere can do their best work.

About The Role

HP IQ's Hardware Design team is responsible for materializing product vision into manufacturable hardware systems. Working closely with Industrial Design, System Software, Electrical Engineering, and Manufacturing partners, this role drives the design and integration of complete hardware products from early architecture and prototype phases through production ramp. The position offers the opportunity to own the mechanical and systems integration challenges that transform concepts into shipping products.

What You Might Do
  • Collaborate with Industrial Design to translate product vision into mechanical design, enclosure layout, and form factor feasibility
  • Integrate multiple subsystems (microphone, speaker, antenna, battery, PCB, sensors, buttons) into a cohesive hardware architecture
  • Produce CAD models, component placement studies, and tolerance analysis to guide manufacturing
  • Work with contract manufacturers and vendors to validate design feasibility, manage drawing releases, and troubleshoot production issues
  • Participate in hands-on prototype builds, design validation, and iterative refinement across development cycles
  • Apply design of experiments methodology to validate material selection, assembly processes, and design assumptions
  • Collaborate with Electrical Engineering on PCB layout, flexible PCB integration, and component placement constraints
  • Define assembly processes, fixturing strategies, and datuming schemes to ensure manufacturability
  • Own design documentation including 2D drawings, specifications, and design rationale for internal and vendor communication
Essential Qualifications
  • Solid understanding of material science fundamentals including stress-strain relationships, thermal properties, and material selection rationale
  • Proficiency with CAD tools and component placement within constrained form factors
  • Familiarity with tolerance analysis, tolerance stacks, and design for manufacturability principles
  • Experience or demonstrated knowledge of manufacturing processes including injection molding, CNC machining, extrusion, and assembly processes
  • Experience with PCB design, flexible PCB, or electrical component integration
  • Ability to operate effectively in ambiguous, prototype-heavy environments; resourcefulness and self-direction essential
  • Strong communication skills with ability to partner across Industrial Design, Engineering, and Manufacturing teams
  • Comfort with hands-on prototyping, lab work, and iterative design refinement
  • Demonstrated ability to work without extensive documentation or rigid structure; thrives in startup-like, fast-moving environments
Preferred Skills
  • Minimum 1-2 years of hardware product design or related experience; prior internship at a consumer electronics company is preferred
  • Experience communicating with contract manufacturers or FATP (final assembly) partners
  • Exposure to design of experiments (DOE) or design validation methodologies
  • Portfolio demonstrating complete hardware projects from design through prototype or production
  • Experience with assembly process design, datuming, and fixturing
  • Familiarity with cross-functional product development from concept through production ramp

Hourly Pay Range: $40.00–$50.00 per hour. Actual compensation will be determined based on factors such as skills, qualifications, and experience.

2027 Internship Program Dates: May/June–August/September 2027. Final dates will be based on student schedules.

Compensation & Benefits (Full-Time Employees)

The salary range for this role is listed above. Final salary offered is based upon multiple factors including individual job-related qualifications, education, experience, knowledge and skills.

At HP IQ, we offer a competitive and comprehensive benefits package, including:

  • Health insurance
  • Dental insurance
  • Vision insurance
  • Long term/short term disability insurance
  • Employee assistance program
  • Flexible spending account
  • Life insurance
  • Generous time off policies, including; 
    • 4-12 weeks fully paid parental leave based on tenure
    • 11 paid holidays
    • Additional flexible paid vacation and sick leave (US benefits overview)

Why HP IQ?

HP IQ is HP’s new AI innovation lab, building the intelligence to empower humanity—reimagining how we work, create, and connect to shape the future of work.

  • Innovative Work
    Help shape the future of intelligent computing and workplace transformation.
  • Autonomy and Agility
    Work with the speed and focus of a startup, backed by HP’s scale.
  • Meaningful Impact
    Build AI-powered solutions that help people and organisations thrive.
  • Flexible Work Environment
    Freedom and flexibility to do your best work.
  • Forward-Thinking Culture
    We learn fast, stay future-focused, and imagine what comes next—together.

Equal Opportunity Employer (EEO) Statement

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

If you’d like more information about HP’s EEO Policy or your EEO rights as an applicant under the law, please click here: Equal Employment Opportunity is the Law Equal Employment Opportunity is the Law – Supplement

Skills Required

  • Solid understanding of material science fundamentals, including stress-strain relationships, thermal properties, and material selection
  • Proficiency with CAD tools and component placement in constrained form factors
  • Familiarity with tolerance analysis, tolerance stacks, and design for manufacturability
  • Experience or demonstrated knowledge of injection molding, CNC machining, extrusion, and assembly processes
  • Experience with PCB design, flexible PCB, or electrical component integration
  • Ability to work effectively in ambiguous, prototype-heavy environments
  • Strong cross-functional communication skills
  • Comfort with hands-on prototyping, lab work, and iterative design refinement
  • Ability to work without extensive documentation or rigid structure
  • Minimum 1-2 years of hardware product design or related experience
  • Prior internship at a consumer electronics company
  • Experience communicating with contract manufacturers or FATP partners
  • Exposure to design of experiments or design validation methodologies
  • Portfolio demonstrating complete hardware projects from design through prototype or production
  • Experience with assembly process design, datuming, and fixturing
  • Familiarity with cross-functional product development from concept through production ramp
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The Company
HQ: Palo Alto
107 Employees

What We Do

HP IQ (formerly Humane) is HP’s new AI innovation lab focused on building an intelligent ecosystem across HP’s products and services for the future of work.

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