Process Integration Engineer, APTD

Posted 13 Days Ago
Be an Early Applicant
Boise, ID, USA
In-Office
Senior level
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Your talent powers our future.
The Role
Develops and integrates semiconductor process flows for advanced memory and packaging technologies, especially wafer-level and reconstructed substrate processing. Leads technical projects, designs experiments, analyzes process and reliability data, resolves integration issues, and collaborates across engineering and manufacturing teams to qualify scalable technologies. Applies data-driven methods and AI tools to improve workflow efficiency, yield, reliability, and technical decision-making.
Summary Generated by Built In
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Department Intro:
The Advanced Packaging Technology Development (APTD) organization develops next-generation packaging and integration technologies for future memory products. We bring together engineers and scientists to overcome complicated integration, performance, and manufacturability challenges. Working across technology development, device engineering, package design, product engineering, reliability, and manufacturing, we turn new concepts into manufacturable solutions for High Bandwidth Memory (HBM) and other advanced memory products.
Position Overview:
As a Process Integration Engineer within APTD, you will develop and integrate semiconductor process flows for next-generation memory and packaging technologies, with a focus on Wafer-Level Technology (WLT) and reconstructed substrates returning to wafer-form fab processing. You will lead technical projects, solve exciting integration problems, and work across engineering fields to balance performance, manufacturability, quality, reliability, cost, and schedule. This role is well suited for an engineer who enjoys hands-on problem solving, collaborative R&D, and using emerging tools such as AI to improve engineering workflows and decision-making.
Responsibilities:
  • Lead technical integration projects for new memory and advanced packaging technologies
  • Design and complete experiments to assess process performance, variability, reliability, and yield
  • Solve complex integration issues using data from inline, defect, parametric, probe, reliability, and package-level testing
  • Partner across Process Integration, Process Development, Device Engineering, Package Design, Product Engineering, Reliability, Materials, and Manufacturing to develop and qualify new technologies
  • Apply AI tools to data analysis, experiment planning, documentation, and technical problem-solving

Minimum Qualifications:
  • BS in Electrical/Chemical/Mechanical Engineering, Materials Science & Engineering, Physics, or a related technical field with 5+ years semiconductor experience; MS in a related field with 4+ years of semiconductor experience; or PhD and 2+ years of semiconductor experience.
  • Experience delivering technical results in process integration, process development, or device development, including experiment design, execution, and analysis
  • Knowledge of semiconductor process integration and memory technologies such as DRAM, NAND, and/or emerging memory architectures
  • Experience solving technical problems using data-driven methods such as statistical analysis, Design of Experiments (DoE), and root-cause analysis
  • Experience leading technical projects, collaborating across functions, communicating complex technical information, and using AI tools to improve technical workflows

Preferred Qualifications:
  • Experience with advanced packaging technologies such as wafer-level packaging, fan-out packaging, 2.5D/3D integration, TSV, microbump, hybrid bonding, or chiplet integration
  • Experience with Wafer-Level Technology or reconstituted wafer flows, including die shift, warpage, thickness/TTV, edge integrity, defectivity, or handling
  • Experience developing, qualifying, and transferring semiconductor processes or integration solutions to high-volume manufacturing, including multi-site development
  • Experience with device or package reliability and test methodologies, including probe, final test, burn-in, stress testing, or reliability qualification
  • Experience applying AI or machine-learning tools to engineering data analysis, anomaly detection, yield improvement, or other engineering workflows

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work click here.
To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at [email protected] or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Skills Required

  • BS in Electrical, Chemical, or Mechanical Engineering, Materials Science and Engineering, Physics, or a related technical field with 5+ years of semiconductor experience
  • MS in a related field with 4+ years of semiconductor experience
  • PhD in a related field with 2+ years of semiconductor experience
  • Experience delivering technical results in process integration, process development, or device development
  • Experience with experiment design, execution, and analysis
  • Knowledge of semiconductor process integration and memory technologies such as DRAM, NAND, or emerging memory architectures
  • Experience using statistical analysis, Design of Experiments, and root-cause analysis to solve technical problems
  • Experience leading technical projects and collaborating across functions
  • Experience communicating complex technical information and using AI tools to improve technical workflows
  • Experience with advanced packaging technologies such as wafer-level packaging, fan-out packaging, 2.5D/3D integration, TSV, microbump, hybrid bonding, or chiplet integration
  • Experience with wafer-level technology or reconstituted wafer flows
  • Experience developing, qualifying, and transferring semiconductor processes or integration solutions to high-volume manufacturing
  • Experience with device or package reliability and test methodologies
  • Experience applying AI or machine-learning tools to engineering data analysis, anomaly detection, yield improvement, or engineering workflows

Micron Technology Compensation & Benefits Highlights

  • Healthcare Strength — Health insurance is portrayed as comprehensive, with medical, dental, vision, prescription coverage and access to on-site or near-site health centers at many locations. Feedback suggests employees regard the coverage as very good overall.
  • Retirement Support — The 401(k) program is considered strong, with company materials citing a 5% match and multiple contribution options. Feedback suggests this match is frequently highlighted as a standout benefit.
  • Equity Value & Accessibility — Equity participation is accessible through a 15%‑discount ESPP, with RSUs offered in eligible roles. Feedback suggests these stock programs add meaningful value to total compensation.

Micron Technology Insights

Am I A Good Fit?
beta
Get Personalized Job Insights.
Our AI-powered fit analysis compares your resume with a job listing so you know if your skills & experience align.

The Company
HQ: Boise, ID
45,000 Employees
Year Founded: 1978

What We Do

We are a world leader in innovative memory solutions that transform how the world uses information to enrich life for all. For over 45 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

Why Work With Us

Global opportunities, team member development, and career advancement—Micron invests in you and celebrates your skills, a growth mindset, and the tenacity to strive. At Micron, everyone innovates.

Gallery

Gallery
Gallery
Gallery
Gallery
Gallery

Micron Technology Offices

Hybrid Workspace

Employees engage in a combination of remote and on-site work.

Micron recognizes the importance of maintaining a healthy work-life balance to foster a culture of collaboration, innovation and meet the needs of the business. In alignment with these values, we offer four flexible work arrangement options

Typical time on-site: Flexible
HQBoise, ID
Bengaluru, Karnataka
Folsom, CA
Hyderabad, Telangana
Longmont, CO
Madhapur, Telangana
Manassas, VA
Milpitas, CA
Singapore, SG
Singapore, SG
Sydney, AU
Ulsoor, Bengaluru
Learn more

Similar Jobs

Micron Technology Logo Micron Technology

Integration Engineer

Artificial Intelligence • Hardware • Information Technology • Machine Learning
In-Office
Boise, ID, USA
45000 Employees

Micron Technology Logo Micron Technology

Integration Engineer

Artificial Intelligence • Hardware • Information Technology • Machine Learning
In-Office
Boise, ID, USA
45000 Employees

Micron Technology Logo Micron Technology

Director, AI Enablement

Artificial Intelligence • Hardware • Information Technology • Machine Learning
In-Office
Boise, ID, USA
45000 Employees
100K-150K Annually

Micron Technology Logo Micron Technology

Integration Engineer

Artificial Intelligence • Hardware • Information Technology • Machine Learning
In-Office
Boise, ID, USA
45000 Employees

Sign up now Access later

Create Free Account

Please log in or sign up to report this job.

Create Free Account