The Role and Impact
As a Process Integration Development Engineer, you will play a pivotal role in developing and implementing advanced process integration solutions for semiconductor manufacturing. You will work at the forefront of innovation, conducting feasibility studies, optimizing processes, and driving advancements that directly impact product performance, reliability, and manufacturability. Your day-to-day tasks will include planning and executing experiments, analyzing big data to identify design flaws, and collaborating with cross-functional teams to meet technology roadmaps.
The position will involve characterizing semiconductor nanostructures using transmission electron microscopy (TEM), diffraction, strain analysis, 4D STEM, EDX, EELS, and coding scripts to expand analytical capabilities. The Engineer is responsible for imaging TEM samples and performing analysis including strain, 4D STEM, EELS, EDX and/or machine learning. The Time-To-Information-Return (TTIR) of this imaging analysis is critical to TD as we advance process nodes and require revolutionary changes in our support structure and methodologies. We are embarking on those changes.
The Engineer will be responsible for but not limited to:
• Technical functions in support of engineering activities such as fabrication, failure analysis, technology development, process development, and process integration.
• Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues.
• Conducts engineering tasks and detailed technical procedures to perform sample preparation or imaging using advanced focused-ion-beam and/or transmission electron microscope tools in support of the research and development activities of Intel.
• Contributes to continuous improvement efforts in high volume manufacturing environments. Learns and applies knowledge, builds skills, and explores future career opportunities through hands on experience and projects that support Intel business goals in a collaborative environment
• Work is completed according to general instructions.
• Some degree of judgment is required in resolving nonstandard problems.
• Performs other related duties as required or as directed.
Job Type:College GradShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- PhD degree in Materials Science, Chemistry, Physics, Applied Physics, or a comparable technical field completed by August 2027
- Experience with Python scripting, MATLAB, or other programming languages
- Hands-on experience operating Transmission Electron Microscopy (TEM)
- Experience with advanced TEM techniques such as 4D STEM, ptychography, and EELS
- Experience with autoscripting for automated TEM data collection
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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