Process Integration Development Engineer

Posted 27 Days Ago
Be an Early Applicant
Hillsboro, OR, USA
In-Office
156K-220K Annually
Junior
Artificial Intelligence • Cloud • Information Technology • Software
Creating world-changing technology that enriches the lives of every person on earth.
The Role
Develop and execute integrated reliability certification strategies for advanced semiconductor process technologies. Design experiments, build statistical and ELF models, assess defect and reliability risk, drive technology certification (HTOL/ELFR), partner with cross-functional teams, and develop automation and AI-assisted analytics to improve product quality and manufacturing readiness.
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Job Details:

Job Description: 

 Come join Intel Foundry's Silicon Technology Development (Si TD) Quality and Reliability organization as a Process Integration Development Engineer within the Integrated Quality and Reliability team.
The Integrated QR team develops and executes integrated reliability methodologies, defect reliability assessments, HTOL/ELFR certification strategies, ELF modeling, and MTS quality systems that enable technology certification for Intel Foundry's leading-edge process technologies. The team partners closely with technology development, design, test and stress, manufacturing, and product organizations to assess technology readiness, mitigate reliability risks, and drive continuous improvements in reliability and product quality.
In this role, you will help drive technology certification and defect reduction by working across organizations to identify reliability risks, evaluate technology readiness, and develop solutions that enable successful technology development and high-volume manufacturing. You will contribute to advancing integrated reliability methodologies, defect reliability assessments, technology certification frameworks, and MTS quality systems supporting Intel Foundry's advanced technology portfolio.
Responsibilities may include but are not limited to:
• Developing and executing integrated and defect reliability certification strategies for advanced semiconductor process technologies, including qualification requirements, certification methodologies, acceptance criteria, and technology health metrics.
• Driving technology certification activities, including HTOL, ELFR, ELF modeling, defect reliability process controls, screening methodologies, and related reliability assessments.
• Designing and executing experiments to characterize reliability behavior, validate reliability models, and understand device and process failure mechanisms.
• Developing reliability risk assessments and providing data-driven recommendations for technology readiness and certification decisions.
• Building and applying statistical models to assess defectivity, latent reliability risk, and product quality.
• Collaborating with process integration, design, device, manufacturing, and product teams to identify and resolve technology reliability challenges.
• Driving statistical quality methodologies, including process capability analysis, MTS, CPK, and process monitoring systems.
• Developing automation, data analytics, and AI-assisted solutions to improve engineering productivity and technical decision making.
• Communicating technical findings, recommendations, certification status, and risks to engineering and management stakeholders.

Additional qualifications include:
• Strong analytical and problem-solving skills.
• Knowledge of semiconductor device physics and manufacturing fundamentals.
• Experience with statistical analysis and experimental design.
• Excellent written and verbal communication skills.
• Ability to work effectively in a highly collaborative and cross-functional environment.

Qualifications:

 Minimum Qualifications
The candidate must possess a Ph.D. degree in Electrical Engineering, Materials Science, Physics, Reliability Engineering, Semiconductor Engineering, or a related technical discipline.
At least 2 years of experience in Semiconductor industry.

Preferred Qualifications:
Experience in one or more of the following areas:
• Semiconductor reliability engineering and technology qualification.
• Advanced CMOS technology development and process integration.
• Defect reliability, latent defect modeling, and reliability statistics.
• HTOL, ELFR, TDDB, BTI, HCI, electromigration, or related reliability mechanisms.
• Product and technology qualification methodologies.
• Semiconductor failure analysis and physical characterization techniques.
• Statistical quality systems, process capability analysis, MTS, and CPK methodologies.
• Design of Experiments (DOE), JMP, SAS, R, or equivalent analytical tools.
• Data analytics, machine learning, and automation using Python, SQL, or similar programming languages.
• AI-assisted data analysis and engineering workflow automation.

          

Job Type:Experienced Hire

Shift:Shift 1 (United States of America)

Primary Location: US, Oregon, Hillsboro

Additional Locations:

Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.



Annual Salary Range for jobs which could be performed in the US: $155,520.00-219,550.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Skills Required

  • Ph.D. in Electrical Engineering, Materials Science, Physics, Reliability Engineering, Semiconductor Engineering, or related technical discipline
  • At least 2 years of experience in the semiconductor industry
  • Strong analytical and problem-solving skills
  • Knowledge of semiconductor device physics and manufacturing fundamentals
  • Experience with statistical analysis and experimental design
  • Excellent written and verbal communication skills
  • Ability to work effectively in a highly collaborative and cross-functional environment
  • Semiconductor reliability engineering and technology qualification experience (HTOL, ELFR, TDDB, BTI, HCI, electromigration)
  • Experience with defect reliability, latent defect modeling, and reliability statistics
  • Semiconductor failure analysis and physical characterization techniques
  • Familiarity with statistical quality systems, process capability analysis, MTS, and CPK methodologies
  • Design of Experiments (DOE) and tools such as JMP, SAS, R
  • Data analytics, machine learning, and automation using Python, SQL, or similar programming languages
  • Experience developing AI-assisted data analysis and engineering workflow automation

Intel Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.

  • Leave & Time Off Breadth Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
  • Parental & Family Support Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
  • Healthcare Strength Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.

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Year Founded: 1968

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