Process Integration and Defect reduction Engineer

Job Details:

Job Description: 

The New Mexico Silicon Manufacturing (NM Si Mfg) Yield Department is seeking Process Integration and Defect Reduction Engineers to support interconnect and advanced packaging semiconductor fabrication for Intel's Foveros and EMIB technologies. In this role, you will collaborate across multiple Yield Department functions, including Process Integration, Defect Reduction, Quality and Reliability, Device Analysis, and Yield Analysis.

Engineers in this organization are responsible for sustaining process health as products transition from development into high-volume manufacturing (HVM), while driving improvements in yield, quality, reliability, cost, and manufacturability. This position offers the opportunity to solve complex technical challenges, leverage data to drive decisions, and influence the successful ramp and production of next-generation semiconductor technologies.

The NM Si Mfg Yield team is looking for engineers who thrive in a fast-paced manufacturing environment and enjoy problem solving, data analysis, and cross-functional collaboration. In this role, you will design and conduct experiments, analyze large datasets, and optimize fabrication processes to improve device performance and manufacturing outcomes.

Key Responsibilities

• Develop and execute experiments to optimize and characterize semiconductor manufacturing processes.
• Analyze process, defect, and yield data to identify trends, correlations, and opportunities for improvement.
• Monitor inline defectivity, parametric performance, and end-of-line yield metrics to ensure process stability.
• Investigate process excursions, determine root causes, and drive corrective actions.
• Manage and control technology change implementation within the manufacturing environment.
• Partner with cross-functional teams to improve yield, quality, reliability, productivity, and cost.
• Support the transfer of new technologies and products from Technology Development (TD) into High-Volume Manufacturing (HVM).
• Develop and implement process control strategies to identify and respond to out-of-control conditions.
• Lead and participate in projects focused on defect reduction, yield improvement, and manufacturing efficiency.
• Respond to quality events and ensure timely disposition support across all phases of the product lifecycle.

Desired Skills and Competencies

• Creative problem-solving skills with the ability to develop innovative technical solutions.
• Strong analytical and data interpretation capabilities, including working with large and complex datasets.
• Knowledge of inline defect detection methodologies and their impact on process performance and yield.
• Effective project management skills, including planning, execution, and risk assessment.
• Understanding of process control monitoring strategies and statistical methods for detecting process variation.
• Ability to influence and collaborate effectively across technical and manufacturing organizations.
• Strong written and verbal communication skills.

Qualifications:

Minimum Qualifications

Must possess a Bachelor's or Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Materials Science, Microelectronics Engineering, Chemistry, Physics, or a related technical field.

Preferred Qualifications

• Experience working in a high-performing team environment with demonstrated leadership, teamwork, and problem-solving skills.
• Fundamental understanding of semiconductor manufacturing process flow.
• Experience applying Design of Experiments (DOE) methodologies.
• Experience supporting High-Volume Manufacturing (HVM) environments.
• Experience with data analysis and statistical process control tools such as JMP, SQL, and PCS.
• Knowledge of Statistical Process Control (SPC), process capability, specification limits, and process variation analysis.
• Strong written and verbal communication skills.
• Experience with semiconductor yield improvement, defect reduction, process integration, or advanced packaging technologies.

          

Job Type:College Grad

Shift:Shift 1 (United States of America)

Primary Location: US, New Mexico, Albuquerque

Additional Locations:

Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $76,390.00-125,660.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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