Process Engineer III

Focus area:

EUV and Multi-patterning Plasma Etching process, Patterning integration, and interconnect formation. Solves complex problems; takes a broad perspective to identify innovative solutions. Works independently, requiring minimal guidance. Will work with cross-functional teams across various locations.

Responsibilities:
• Primarily responsible for development and characterization of Plasma Etching processes on equipment in the factory applications lab.
• Develops processes related to semiconductor process equipment in the advanced logic and memory applications space.
• Performs simple maintenance on the applications lab equipment as needed.
• Designs and executes process optimization experiments. Characterizes, compiles, and analyzes test data to determine appropriate limits and variables for process or material specifications.
• Works with sales and marketing groups, along with other functional areas, to prepare changes, additions, and modifications, which will facilitate customer adoption and improve quality of process equipment.
• Provides applications development support to our various customers in the field. May require international travel for process start up and support of process tools at customer sites.
• Responsible for quality processing of all material processed through the machine, including internal process development activities and customer demonstrations.
• Coordinates machine activities in the applications lab including process development work, maintenance activities, troubleshooting, etc.
• Provides input for customer demo experimental design; acts as a technical customer interface.
• Provides input to TEL factory on process and machine issues and works closely with the factory on solutions.
• Conducts various integration activities with internal business units.

• Travel required up to 25% for internal/external meetings and support other facilities. 

Typical Education and Experience:
Master's Degree in Material Science or Chemical Engineering or the like. PhD preferred. Must be legally authorized to work in US without sponsorship

Preferred Skills and Education:

Previous experience / research / lab work in plasms etch, ideally in FEOL/MEOL/BEOL and advanced node technology.

Physical Demands and Work Conditions:
The physical demands described herein are representative of those that must be met by an employee to successfully perform the essential functions of this job. This job operates in an office setting. This role routinely uses standard office equipment such as computers, phones, photocopiers, and filing cabinets. This is a largely sedentary role; however, some filing is required, which would require the ability to lift files, open filing cabinets and bend or stand as necessary. This position requires the ability to occasionally lift office products and supplies, up to 35 pounds. This position also requires 4 to 6 hours per day at a computer screen/keyboard.

Diversity creates an innovative culture. TEL US is an Equal Employment Opportunity / Affirmative Action employer, and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, age, national origin, protected veteran status, disability status, sexual orientation, gender identity or expression, marital status, genetic information, or any other characteristic protected by law. Equal Opportunity Employer/Minorities/Females/Disabled/Veterans

computer screen/keyboard.