Process Engineer Section Manager

Reposted 21 Days Ago
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Lapu-Lapu City, Cebu, Central Visayas, PHL
In-Office
Senior level
Automotive • Cloud • Energy
The Role
Lead FOL Process Engineering organization, ensuring stable yield, high process capability, and driving continuous improvement and compliance. Oversee yield losses and audit readiness.
Summary Generated by Built In

Basic Purpose of the Job

•Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI).
•Ensure stable yield, high equipment/process capability, adherence to customer and reliability requirements, and timely closure of quality/EFAR/GMRB issues.
•Drive continuous improvement, standardization, process governance, and readiness for volume and package‑mix expansion.

Reporting Relationship

•Reports to the Assembly Engineering Manager; leads a team of Process Engineers across Die Attach, Clip Attach, Wire Bond, Plasma and AOI.
Responsibilities

Major Duties and Responsibilities

•Provide strategic process ownership for all FOL Package Group (SPC governance, PFMEA/Control Plan, recipe management, process capability Ppk, documentation).
•Lead engineering responses to yield losses, top defect contributors, customer complaints, reliability audit failures, and GMRB cases.
•Oversee execution of Continuous Improvement Plan, productivity projects, and proliferation activities across CBSM, SOSM, and PPD packages.
•Ensure audit readiness (IATF/ISO/Customer), compliance to change control, and cross‑functional alignment with Production, Quality, Equipment, NPI, Planning, and SQE.
•Develop technical talent, strengthen process ownership, and balance engineering workload.
Qualifications
Education
•Bachelor’s degree in Engineering (Mechanical, Electronics, Chemical, or related field).
Experience
•8+ years in semiconductor assembly (Die Attach / Wire Bond), with proven leadership in high‑mix, high‑complexity FOL operations.
•Demonstrated capability in yield improvement, DOE, SPC, PFMEA/Control Plan, and equipment/materials qualification.
Skills & Knowledge Requirements
•Strong technical mastery in FOL processes (DA, WB, Clip Attach, Plasma) and failure mechanisms.
•Excellent analytical skills (Minitab/Exensio/SPC), problem‑solving (8D, DMAIC), and audit/customer‑facing communication.
•Ability to lead teams, manage cross‑functional escalations, and sustain process governance under high‑volume/high‑complexity environments
About Us
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

About the Team
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

Skills Required

  • Bachelor's degree in Engineering (Mechanical, Electronics, Chemical, or related field)
  • 8+ years in semiconductor assembly (Die Attach / Wire Bond)
  • Strong technical mastery in FOL processes (DA, WB, Clip Attach, Plasma)
  • Excellent analytical skills (Minitab/Exensio/SPC)
  • Ability to lead teams in high-complexity environments

onsemi Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about onsemi and has not been reviewed or approved by onsemi.

  • Retirement Support Retirement programs are highlighted by a U.S. 401(k) with a 100% match on the first 4% and immediate vesting. International plans such as Ireland’s defined contribution scheme and Germany’s company-funded pension elements reinforce long-term savings.
  • Leave & Time Off Breadth Time-off policies include ten paid holidays, flexible vacation for exempt employees, and three to five weeks of vacation for non-exempt staff as tenure grows, alongside sick time accrual. Paid leaves span parental, bereavement, jury duty, and military service, with Europe locations offering additional statutory and seniority-based days.
  • Parental & Family Support Family supports include eight weeks of paid parental leave, company-sponsored backup care for children, adults, and pets, and up to $15,000 in adoption assistance. Regional provisions such as Switzerland’s child allowance and accessible EAP counseling show added attention to household needs.

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The Company
HQ: Phoenix, AZ
11,712 Employees

What We Do

We are building a better future through intelligent technology. For over 60 years, onsemi and its ancestors have been leading the world’s greatest technology advancements. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

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