Job Title: Principal Engineer, Signal-Integrity and Power-Integrity
Office Location: San Jose, CA
Work Model: Onsite
About SK hynix America
At SK hynix America, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape.
We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.
Job Summary:
SK hynix America is seeking a Principal Engineer to lead the Signal‑Integrity and Power‑Integrity (SIPI) strategy for next‑generation advanced packaging technologies. In this role, you will lead the design, analysis, and validation of next generation advanced packaging solutions for HBM and beyond HBM such as logic-memory integration. The position requires deep technical expertise in high-speed interface design, collaboration with global R&D teams, and contributions to industry standards for advanced packaging.
Responsibilities:
- Strategic Leadership: Define and own the SIPI roadmap for advanced PKG families, aligning technical direction with product and business goals.
- Architecture & Design: Lead the creation of high‑performance SiP architectures (HBM, interposer, 3 D stacks) and validate power‑delivery and signal‑integrity across the full stack—from silicon to substrate.
- Methodology Development: Invent and propagate best‑practice SIPI methodologies, including electromagnetic extraction, multi‑port S‑parameter modeling, and power‑network analysis for complex packaging environments.
- Technical Ownership: Oversee the end‑to‑end design flow (package definition, simulation, layout sign‑off, tape‑out) and drive continuous improvement of tools, scripts, and automation.
- Mentorship & Talent Development: Coach senior and junior engineers, fostering expertise in SIPI analysis, tool usage, and design verification; champion knowledge‑sharing across global teams.
- Risk Management & Sign‑off: Conduct comprehensive risk assessments, lead design reviews, and deliver final SIPI sign‑off packages that meet performance, reliability, and schedule targets.
Qualifications:
- Education: Ph.D. in Electrical Engineering, or a related field (or Master’s degree with 5+ years of relevant industry experience).
- Experience: ≥ 5 years of hands‑on SIPI engineering in advanced semiconductor packaging.
- Technical Expertise: Deep knowledge of 2.5 D/3 D package architectures, HBM, interposer, TSV, high‑speed I/O standards, and power‑delivery networks. Proven proficiency with SIPI simulation tools (e.g., Ansys SIwave/RedHawk, Cadence Sigrity).
- Design Flow Mastery: Strong background in electromagnetic extraction, multi‑port S‑parameter analysis, power‑network optimization, and tape‑out sign‑off processes for complex packages.
- Leadership Skills: Demonstrated ability to influence multi‑disciplinary teams, drive technical decisions, and mentor senior engineers.
- Communication: Excellent verbal and written communication skills; ability to present complex technical concepts to both engineering and executive audiences.
Preferred Qualifications:
- Hands-on experience with 2.5D/3D packaging for HBM, interposers, or GPU-memory integration.
- Expertise in power integrity (PI) for 3D-stacked memory systems, including PDN impedance profiling and IBIS model validation for HBM.
- In‑depth familiarity with industry standards such as PCIe Gen5/Gen6, CXL, UCIe, and JEDEC memory specifications.
- Familiarity with advanced packaging workflows from ball map definition to tape-out for interposer-based designs.
- Proficiency in scripting/automation (Python, TCL, SKILL) to create custom analysis flows and improve productivity.
- Experience validating high-speed memory interfaces using oscilloscopes, VNAs, and compliance test platforms specific to 3D packaging.
- History of published technical papers, patents, or conference presentations in advanced packaging or SIPI.
Benefits:
- Top Tier health insurance at no employee cost
- Paid day offs: PTO + Company Holidays + Happy Fridays
- Paid Parental Leave Program
- 401k Matching
- Educational reimbursement up to $10,000 per year
- Donation Matching and volunteering opportunities
- Corporate discount programs
- Free Breakfast/Lunch/Dinner provided to employees
Equal Employment Opportunity:
SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws.
Compensation:
Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.
SK hynix Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about SK hynix and has not been reviewed or approved by SK hynix.
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Strong & Reliable Incentives — Profit-sharing linked to operating results and the removal of a bonus cap in Korea have produced very large payouts and materially boosted total compensation there. Reporting indicates these incentives have been especially favorable during the AI/HBM upcycle.
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Healthcare Strength — Company materials highlight medical expense support and robust health coverage, and U.S. packages commonly include comprehensive medical, dental, and vision plans. This strengthens the appeal of core benefits alongside cash compensation.
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Parental & Family Support — Programs in Korea include fertility support, extended childcare leave, and education grants for children through university. These family-forward policies expand benefits value beyond salary and bonuses.
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What We Do
Semiconductors are essential to all IT products, and its performance often determines the performance of the final products. SK hynix is a global leader in producing semiconductor, such as DRAM, NAND Flash and CMOS Image Sensors. With these technology driven semiconductor products, SK hynix has consistently led the industry and is now the second largest memory chip maker worldwide. IT devices become more pervasive as new imaginative and innovative IT products continue to grab imagination and desires of consumers. SK hynix has enhanced its competency with the best level of technology and a wide range of business portfolios in order to satisfy all those demand from customers. As a member of SK Group*, SK hynix is aiming at becoming the world’s best semiconductor company. SK hynix America Inc. operates as a subsidiary of SK Hynix Inc. *SK Group is one of South Korea's top five industrial conglomerates. It has about 40 affiliated companies, ranging from energy, telecommunications, finance, to construction.
