Principal Engineer, Router Architect

Posted 4 Days Ago
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Austin, TX, USA
Hybrid
Expert/Leader
3D Printing
The Role
Architect next-generation automotive Ethernet routing engines, PCIe backbones, and zonal interconnect fabrics for autonomous driving and cockpit systems. Define deterministic TSN networking, high-speed SoC connectivity, virtualization, functional safety mechanisms, cybersecurity isolation, and clock, reset, and power-management architectures. Ensure compliance with ISO 26262, ASIL requirements, AEC-Q100, and automotive thermal and reliability standards while integrating AXI/CHI fabrics and IOMMU configurations.
Summary Generated by Built In
Job Description

We are seeking a Principal Router Architect with 10 to 15 years of experience to define the backbone of next-generation Zonal and Central Compute Automotive architectures. This role focuses on architecting high-bandwidth, ultra-reliable Ethernet Routing Engines and PCIe subsystems that serve as the primary data fabric for Autonomous Driving (AD) and Cockpit controllers. The ideal candidate will bridge the gap between high-speed data center-grade throughput and the rigorous Safety (ISO 26262) and Deterministic Networking requirements of the automotive industry.

Responsibilities:

  • Automotive Ethernet Routing: Architect L2/L3 switch fabrics supporting Time-Sensitive Networking (TSN) standards (e.g., IEEE 802.1AS, 802.1Qbv, 802.1Qbu) to ensure deterministic latency for safety-critical traffic.
  • PCIe Backbone Architecture: Define PCIe Gen 5/6 integration for high-speed chip-to-chip connectivity between SoCs, AI accelerators, and storage, including support for SR-IOV to virtualize resources across multiple Virtual Machines (VMs).
  • Functional Safety (ASIL): Integrate hardware safety mechanisms (ECC, Parity, BIST, and End-to-End protection) to meet ASIL-B/D requirements within the routing engine and bus fabrics.
  • Zonal Interconnect & Bus Fabric: Design the interface between Ethernet/PCIe controllers and internal NoC/CHI fabrics, ensuring efficient data movement for ADAS sensors (Camera, LiDAR) and telemetry.
  • Virtualization & Security: Architect hardware-assisted isolation and Secure On-board Communication (SecOC) to protect the vehicle network from cyber threats while allowing shared access to network resources.
  • Infrastructure & Power: Define robust clock, reset, and power management schemes capable of operating under automotive thermal profiles and supporting rapid "Instant-On" boot requirements

Qualifications

 

  • Education: Bachelor’s or Master’s in Electrical Engineering or Computer Engineering (PhD desirable)
  • Experience: 12+ years in high-speed networking or SoC architecture, with at least 5 years focused on Automotive-grade silicon.
  • TSN Mastery: Deep expertise in IEEE 802.1 TSN protocols and their hardware implementation for real-time traffic shaping and synchronization.
  • Protocol Expertise: Expert knowledge of PCIe (Root Complex/Endpoint) and Automotive Ethernet (10BASE-T1S to 10G+ levels).
  • Automotive Standards: Familiarity with ISO 26262 functional safety flows and AEC-Q100 reliability requirements.
  • System Integration: Proven track record of integrating routing engines into complex SoCs using AXI/CHI bus protocols and managing IOMMU configurations.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Skills Required

  • Bachelor's or Master's degree in Electrical Engineering or Computer Engineering
  • 12+ years of experience in high-speed networking or SoC architecture
  • At least 5 years of experience with automotive-grade silicon
  • Deep expertise in IEEE 802.1 Time-Sensitive Networking protocols and hardware implementation
  • Expert knowledge of PCIe Root Complex and Endpoint architectures
  • Expert knowledge of Automotive Ethernet from 10BASE-T1S through 10G+
  • Familiarity with ISO 26262 functional safety flows
  • Familiarity with AEC-Q100 reliability requirements
  • Experience integrating routing engines into complex SoCs using AXI and CHI bus protocols
  • Experience managing IOMMU configurations
  • PhD in Electrical Engineering or Computer Engineering

Renesas Electronics Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Renesas Electronics and has not been reviewed or approved by Renesas Electronics.

  • Fair & Transparent Compensation — Feedback suggests pay is generally fair-to-good across many roles, with base pay aligned to prevailing market levels in multiple U.S. locations. Engineering and leadership tracks can be competitive on total compensation, reinforcing a sense that pay can meet market expectations in key job families.
  • Healthcare Strength — Feedback suggests core medical, dental, and vision coverage is solid and well-regarded by employees. Day-one eligibility in U.S. roles is described, supporting confidence in access and continuity of care.
  • Leave & Time Off Breadth — Feedback suggests PTO, paid holidays, sick time, and parental leave provide a comprehensive time-off framework. Company initiatives like Renesas Day and meeting-light Focus Fridays further support time away and balance.

Renesas Electronics Insights

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The Company
HQ: Tokyo
10,040 Employees

What We Do

We're the world's leading semiconductor manufacturer. Our mission is to make our lives easier and a world that's safer, healthier, greener, and smarter.

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