Principal Engineer - HIG HBM - ARCHITECTURE

Posted Yesterday
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Richardson, TX, USA
In-Office
Senior level
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Your talent powers our future.
The Role
Defines next-generation HBM PHY and analog/mixed-signal I/O architectures for high-bandwidth memory products. Responsibilities include transmit and receive path design, clocking, signaling, equalization, timing budgets, analog calibration, adaptive tuning, and silicon learning methodologies. The role leads cross-functional architectural decisions, evaluates performance, power, area, reliability, and manufacturability tradeoffs, drives roadmap innovation, develops engineering standards, and mentors design teams through concept-to-silicon execution.
Summary Generated by Built In
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
The High-Performance Integrated Group (HIG) develops next-generation High Bandwidth Memory (HBM) solutions for AI, machine learning, and high-performance computing applications. We are seeking an experienced HBM Architecture Engineer to define and drive the architecture of high-speed analog and mixed-signal IO subsystems for HBM products.
This role focuses on PHY IO architecture, timing methodology, analog calibration schemes, and silicon learning frameworks that enable industry-leading bandwidth, power efficiency, and robustness. The successful candidate will collaborate across Design, Product Engineering, Modeling, Verification, Packaging, and System Architecture teams to define architectural requirements, drive technology innovation, and ensure successful translation from concept to silicon.
As a technical leader, you will influence future HBM roadmap decisions, develop engineering methodologies, and mentor design teams on architectural principles, calibration strategies, and best practices for high-speed IO design.
Key Responsibilities
  • Define and drive next-generation HBM PHY and IO architecture, balancing performance, power, area, reliability, and manufacturability requirements.
  • Architect high-performance transmit and receive paths, including clocking, signaling, equalization, timing alignment, and interface optimization.
  • Define and optimize analog calibration architectures, including impedance calibration, reference voltage calibration, timing calibration, and adaptive tuning methodologies.
  • Develop and maintain IO timing budgets, design targets, and margin methodologies across process, voltage, temperature, and package variations.

Required Qualifications
  • MS or PhD in Electrical Engineering or a related field.
  • 7+ years of experience in semiconductor design, architecture, or technology development.
  • Demonstrated expertise in analog and mixed-signal IO design and architecture.
  • Deep knowledge of high-speed transmitter, receiver, clocking, and timing architectures.
  • Strong technical communication and documentation skills.

Preferred Qualifications
  • Experience with HBM, DDR, UCIe, PCIe, or other high-speed memory and interconnect technologies.
  • Experience developing and evaluating analog calibration schemes, including impedance calibration, reference voltage calibration, timing calibration, adaptive and background calibration techniques
  • Experience with advanced packaging technologies, including 2.5D, 3D integration, and TSV-based systems.
  • Background in clock generation, clock distribution, PLLs, phase alignment, or timing recovery circuits.
  • Experience with silicon bring-up, product engineering, or post-silicon debug.
  • Demonstrated use of AI-enabled analytics or automation techniques to improve design quality, silicon analysis, or engineering productivity.
  • Experience developing design methodologies, architecture standards, and engineering training material.
  • Strong understanding of simulation, modeling, silicon characterization, and simulation-to-silicon correlation.
  • Proven ability to perform architectural tradeoff analysis across performance, power, area, and reliability constraints.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at [email protected] or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Skills Required

  • MS or PhD in Electrical Engineering or a related field
  • 7+ years of experience in semiconductor design, architecture, or technology development
  • Expertise in analog and mixed-signal I/O design and architecture
  • Deep knowledge of high-speed transmitter, receiver, clocking, and timing architectures
  • Strong technical communication and documentation skills
  • Experience with HBM, DDR, UCIe, PCIe, or other high-speed memory and interconnect technologies
  • Experience developing analog calibration schemes, including impedance, reference voltage, timing, adaptive, and background calibration
  • Experience with advanced packaging technologies, including 2.5D, 3D integration, and TSV-based systems
  • Background in clock generation, clock distribution, PLLs, phase alignment, or timing recovery circuits
  • Experience with silicon bring-up, product engineering, or post-silicon debug
  • Experience using AI-enabled analytics or automation techniques for design quality, silicon analysis, or engineering productivity
  • Experience developing design methodologies, architecture standards, and engineering training materials
  • Strong understanding of simulation, modeling, silicon characterization, and simulation-to-silicon correlation
  • Ability to perform architectural tradeoff analysis across performance, power, area, and reliability constraints

Micron Technology Compensation & Benefits Highlights

  • Retirement Support A company 401(k) match with multiple savings options and investment choices supports long‑term financial security. This element stands out as a core strength within the overall package.
  • Equity Value & Accessibility An employee stock purchase plan offered at a meaningful discount and management‑granted RSUs provide accessible ownership opportunities that can bolster total compensation. These programs create upside beyond base pay.
  • Healthcare Strength Multiple medical plan choices with dental, vision, and company‑paid disability and life coverage, plus an EAP and some onsite/near‑site health centers, indicate robust core protection. The breadth of health options is consistently emphasized across the offering.

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The Company
HQ: Boise, ID
45,000 Employees
Year Founded: 1978

What We Do

We are a world leader in innovative memory solutions that transform how the world uses information to enrich life for all. For over 45 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

Why Work With Us

Global opportunities, team member development, and career advancement—Micron invests in you and celebrates your skills, a growth mindset, and the tenacity to strive. At Micron, everyone innovates.

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Employees engage in a combination of remote and on-site work.

Micron recognizes the importance of maintaining a healthy work-life balance to foster a culture of collaboration, innovation and meet the needs of the business. In alignment with these values, we offer four flexible work arrangement options

Typical time on-site: Flexible
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