At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI
hardware is built for the future.
We are actively seeking Physical Design Engineers based in Hyderabad OR Bangalore
Required competences - Experience
10+ years’ experience in the semiconductor industry, with min. 5 years in a digital Physical Design technical leadership role
Experience on modern semiconductor process technologies including 28nm, 14/16nm, 7nm
Experienced user of EDA tools for design and verification such as, Cadence Genus and Innovus, LEC, Calibre/PVS DRC/LVS, parasitics extraction, EM and IR drop, ESD, etc.
Expertise in Timing Constraints and Static Timing Analysis (STA)
Experience in CPF/UPF technologies and flows is highly desirable
Exposure to flip-chip package technologies and wire bond package technologies
Experience in hierarchical floor planning and implementation
Experience in release management and tape out procedures
Experience in library setup and flow development with focus on cross project reusability
Experience in DFT methodologies and implementation schemesRequired
Competencies – Skills
Required competences - Skills
Good understanding of RTL to GDS implementation flow (synthesis, P&R, LEC, PV)
Self-motivated, with strong sense of ownership and responsibility. Good communicator and team player
Good scripting capabilities (shell, TCL, Python, make) and good understanding of data management (revision control system)
Responsibility and Authority
Responsibility and Authority
As a Physical Design Engineer, you will work closely with the Architecture, RTL, DFT teams to ensure first-time-right high-volume silicon production
Timing constraints improvement and timing constraints validation, signoff Static Timing Analysis and block-level timing closure
Synthesis, block level floor-planning, power grid design, place & route, clock tree synthesis, electromigration / IR-Drop analysis, power/signal integrity analysis, crosstalk analysis, formal equivalence checking and physical verification (DRC / LVS / Antenna)
Participate in developing improvements to scripts/methodologies/flows
Interact closely with the design team to understand requirements and implement solutions as also helping on providing design views for use with digital PD flows (LIB, LEF, DEF, GDS, SPEF, etc.)
Support IP and chip level integration
Support and interact with customers on requirements and IP delivery
Manage workload and schedule and report to internal management team
Education
Bachelors/Masters of Engineering in Electronics and Electrical Engineering/Computer Science (equivalent or higher)
https://www.kandou.ai/
Skills Required
- 10+ years of experience in the semiconductor industry
- At least 5 years in a digital physical design technical leadership role
- Experience with modern semiconductor process technologies including 28nm, 14nm, 16nm, and 7nm
- Experience using EDA tools including Cadence Genus, Innovus, LEC, Calibre, and PVS
- Expertise in timing constraints and static timing analysis
- Experience with hierarchical floor planning and implementation
- Experience with release management and tapeout procedures
- Experience in library setup and reusable flow development
- Experience with DFT methodologies and implementation schemes
- Understanding of RTL-to-GDS implementation flow
- Good scripting capabilities in shell, Tcl, Python, and Make
- Understanding of data management and revision control systems
- Bachelor's or master's degree in Electronics Engineering, Electrical Engineering, Computer Science, or equivalent
- Experience with CPF/UPF technologies and flows
- Exposure to flip-chip and wire-bond package technologies
What We Do
Kandou AI is a fabless semiconductor company developing high-speed connectivity for AI infrastructure. Its patented Copper MIMO, also known as Chord Signaling, sends correlated signals at data-processing speeds of 448 Gbps and beyond, providing an alternative to optical interconnects. The company’s technology targets AI data-movement bottlenecks and memory-wall constraints, while its platforms emphasize improved efficiency, lower power and cost, and scalability.
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