Change the world. Love your job.
Texas Instruments (TI) is out front and ready for the next big challenge. Our innovations are at the core of nearly every electronics product in use today. And it doesn't stop there. We're developing breakthrough technology to power the world's future innovations as well. TI is committed to building a better future — from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. Put your talent to work with us.
Our business has very high growth in TI and is in a segment where the market is fast growing. We're searching for applications engineer who have the passion and excitement to grow, innovative, take an active role in product definition, execute the characterization until ramp, and provide post ramp application support to customers.
The Texas Instruments Optical Signal Chain and Controllers team is seeking a highly motivated and experienced Senior Applications Engineer to lead customer support, debug, and characterization of next-generation optical ICs, electrical ICs, silicon-photonics-based optical sub-assemblies, and optical engines for high-speed data communications applications. You will be the link between product design and customer experience, playing a pivotal role in the product lifecycle by solving technical challenges, integrating devices into customer systems and translating feedback into design improvements. In addition, you will architect, assemble, and bring up high-speed (> 50 GHz) bench test setups while driving high quality, accurate, and high throughput measurement procedures and reporting. You may also supervise and mentor junior applications engineers.
Key Responsibilities
- Hands-On Customer Support Leadership: Drive external-facing interactions, answering customer and partner questions and supporting design-in activities for new products.
- Test Setup Development: Lead the specification, assembly, and validation of custom, high-speed (> 50GHz) electrical, electro-optical, and optical-optical die-level test setups.
- Equipment & Tool Management: Identify, select, and procure necessary test tools and equipment; partner directly with equipment vendors to bring up and troubleshoot measurement systems.
- Device Characterization Strategy & Execution: Collaborate with design teams and product architects to formulate comprehensive test plans across die, package, and board levels. Must be strongly familiar with industry standard practices for high-volume high-speed electrical and optical characterization.
- Data Management & Visualization: Build and maintain structured databases of measurement data; analyze and report out findings using data visualization tools.
- Leadership & Supervision: Direct, coordinate, and supervise the daily testing efforts of junior applications engineers. Coordinate application and validation efforts across multiple global sites.
Minimum Qualifications:
- Experience: 5+ years industry experience in datacenter transceiver and high-speed electrical and optical interfaces (at least 50Gbps/lane PAM4; 200Gbps/lane strongly preferred).
- Hands-on bench setup development and bring-up: Hands-on experience with die/package-level testing, small and large signal testing, and high throughput test automation. Experience with the design and bring-up of multi-purpose high-speed opto-electrical test stations.
- Equipment: Expertise with high-speed (> 50 GHz) test equipment including Lightwave Component Analyzers (LCA), DCAs, AWGs, and real-time oscilloscopes.
- Lab automation: Develop and optimize robust bench test automation scripts to maximize throughput and device characterization coverage, while ensuring repeatability and streamlining data logging and databasing.
- Time management: Track record of solid time management, and the ability to multitask across multiple test setups in parallel.
- Interfacing & Coupling: Proven knowledge of single- and multi-channel optical fiber coupling schemes (normal-incidence, edge coupling, grating couplers) fiber alignment procedures, and high-speed electrical interfacing (direct RF probing, high-speed connectors).
- Leadership: Demonstrated ability to lead test initiatives and coordinate junior engineering staff. Experience summarizing and presenting complex test results to cross-functional teams. Excellent written and verbal communication skills.
Preferred Qualifications:
- Hands-on PCB and optical assembly experience tailored for test environments.
- Proficiency in Python, Matlab, JMP, and Spotfire.
- The future starts here. As a TIer, you'll play a critical role in defining the next era of semiconductor technology and help create the innovations that shape the world around us.
- Surround yourself with a team of innovators who value your unique perspective and will challenge you to bring your best self to work every day. We believe that fostering a culture of collaboration fuels both personal growth and technological breakthroughs. Explore our company culture.
- At TI, your success goes beyond your work. Take advantage of comprehensive benefits designed to support your total well-being at work and in life, from competitive compensation to extensive health coverage and wellness programs. Learn more about our benefits offerings.
Skills Required
- 5+ years of industry experience with datacenter transceivers and high-speed electrical and optical interfaces
- Experience with at least 50 Gbps/lane PAM4; 200 Gbps/lane strongly preferred
- Hands-on experience with die- and package-level testing, small- and large-signal testing, and high-throughput test automation
- Experience designing and bringing up multipurpose high-speed opto-electrical test stations
- Expertise with high-speed test equipment above 50 GHz, including LCAs, DCAs, AWGs, and real-time oscilloscopes
- Ability to develop and optimize robust bench test automation scripts, data logging, and databases
- Knowledge of single- and multichannel optical fiber coupling, fiber alignment, and high-speed electrical interfacing
- Ability to lead test initiatives, coordinate junior engineering staff, and present complex test results
- Excellent written and verbal communication skills
- Hands-on PCB and optical assembly experience for test environments
- Proficiency with Python, MATLAB, JMP, and Spotfire
Texas Instruments Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Texas Instruments and has not been reviewed or approved by Texas Instruments.
-
Strong & Reliable Incentives — Profit sharing and annual bonuses are portrayed as a meaningful, formula-linked upside that can materially lift total earnings in strong years. An employee stock purchase plan with a discount further reinforces recurring, wealth-building incentives.
-
Retirement Support — A 401(k) match is described as a stable core benefit, with some references to additional legacy employer contributions and even pension-like elements for certain cohorts. This framing positions long-term savings support as a notable part of the overall rewards package.
-
Healthcare Strength — Medical coverage is depicted as broadly comprehensive, with preventive care and access to HSA/FSA features cited as value-adds. Company-seeded HSA contributions are repeatedly characterized as an important offset to the plan design for those enrolled.
Texas Instruments Insights
What We Do
Texas Instruments develops semiconductor and computer technology for cellular handsets, digital signal processors and analog semiconductors. Texas Instruments has been making progress possible for decades. We are a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. Our more than 80,000 products help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. Our passion to create a better world by making electronics more affordable through semiconductors is alive today as each generation of innovation builds upon the last to make our technology smaller, more efficient, more reliable and more affordable – opening new markets and making it possible for semiconductors to go into electronics everywhere. We think of this as Engineering Progress. It’s what we do and have been doing for decades. Learn more https://news.ti.com/index.cfm
