PCBA Manufacturing Engineer

Posted Yesterday
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Milpitas, CA, USA
In-Office
114K-157K Annually
Mid level
Hardware • Other • Appliances
The Role
Drive development, industrialization, and optimization of PCBA manufacturing processes for AI, rack-scale computing, and data center products. Lead NPI builds, production readiness, process validation, yield improvement, defect troubleshooting, DFM/DFA reviews, manufacturing documentation, root cause analysis, and continuous improvement across SMT and assembly operations. Partner cross-functionally with design, quality, test, supply chain, and operations teams to improve manufacturability, reliability, throughput, cycle time, and cost.
Summary Generated by Built In
Flex is the diversified manufacturing partner of choice that helps market-leading brands design, build and deliver innovative products that improve the world.

A career at Flex offers the opportunity to make a difference and invest in your growth in a respectful, inclusive, and collaborative environment. If you are excited about a role but don't meet every bullet point, we encourage you to apply and join us to create the extraordinary.

Job Summary To support our extraordinary teams who build great products and contribute to our growth, we’re looking to add a PCBA Manufacturing Engineer located in Milpitas, CA. 

Reporting to the Director, Operations Engineering, the PCBA Manufacturing Engineer will play a critical role in the development, industrialization, and optimization of advanced PCBA manufacturing processes supporting next-generation AI, rack-scale computing, and data center applications. This position is part of a cross-functional team (CFT) responsible for building and scaling complex printed circuit board assemblies at the Milpitas campus.

The ideal candidate will possess hands-on experience across the complete SMT manufacturing process, including pick-and-place, reflow soldering, wave soldering, process validation, and yield improvement. This role requires a strong understanding of PCBA chemistry, mechanical interactions, manufacturing design considerations, and advanced packaging technologies, including large BGA components utilized in high-performance AI infrastructure. This position aligns with the core responsibilities of Manufacturing Engineering as defined within the Flex Production Engineering organization.

 

What a typical day looks like:

  • Drive and optimize the end-to-end PCBA manufacturing process, including solder paste printing, pick-and-place, reflow, wave soldering, inspection, and final assembly for AI, rack-scale computing, and data center products.
  • Lead NPI builds and production readiness activities while partnering with Design, Quality, Test, Supply Chain, and Operations teams to ensure manufacturability, yield, reliability, and scalable production.
  • Provide technical expertise for complex PCBAs featuring large BGA devices, supporting process development, thermal profiling, defect reduction, DFM/DFA reviews, and assembly optimization.
  • Troubleshoot manufacturing, process, and product-related issues using structured root cause analysis and implement corrective and preventive actions to improve quality and throughput.
  • Develop and maintain manufacturing documentation, including work instructions, process specifications, PFMEAs, control plans, validation reports, and process control strategies.
  • Analyze manufacturing data and lead continuous improvement initiatives focused on yield enhancement, cycle-time reduction, cost optimization, equipment efficiency, and overall operational excellence.
 

The experience we’re looking to add to our team:

  • Bachelor's degree in Manufacturing Engineering, Mechanical Engineering, Materials Engineering, Electrical Engineering, or a related technical discipline.
  • 3-5 years of hands-on experience in PCBA manufacturing, with strong knowledge of the complete SMT process including solder paste printing, pick-and-place, reflow soldering, wave soldering, AOI, SPI, X-ray inspection, and process optimization for high-volume production.
  • Experience supporting complex PCBAs featuring large BGAs, high-density assemblies, and advanced packaging technologies, with the ability to troubleshoot manufacturing defects such as voiding, head-in-pillow, bridging, warpage, insufficient solder, and BGA-related failures.
  • Strong understanding of PCBA materials, solder chemistry, thermal management, mechanical interactions, and reliability considerations that impact assembly performance and manufacturing yield.
  • Working knowledge of DFM, DFA, IPC standards, PFMEA, control plans, manufacturing validation methodologies, and experience supporting NPI programs from development through successful production ramp.
  • Experience supporting AI servers, accelerator cards, GPU-based platforms, rack-scale computing, or data center infrastructure products, combined with strong analytical, problem-solving, and cross-functional collaboration skills in a fast-paced manufacturing environment.

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What you'll receive for the great work you provide:

  • Full range of medical, dental, and vision plans
  • Life Insurance
  • Short-term and Long-term Disability
  • Matching 401(k) Contributions
  • Vacation and Paid Sick Time
  • Tuition Reimbursement

Application Deadline:

Applications for this job position will be accepted for at least five days following the job posting start date below and continuing until the end date below or until the position is filled. This posting may close sooner due to application volume.

Job Posting Start Date 10-26-2026 Job Posting End Date 01-29-2027

The base pay range for this position is provided below. The final base rate offered will be determined using job-related, non-discriminatory criteria, including but not limited to experience, qualifications, geographic location, education, external market data, and internal equity.

$114,300.00 USD - $157,100.00 USD Annual

Job CategoryProduction Engineering

Is Sponsorship Available?

No

Flex is an Equal Opportunity Employer and employment selection decisions are based on merit, qualifications, and abilities. We do not discriminate based on: age, race, religion, color, sex, national origin, marital status, sexual orientation, gender identity, veteran status, disability, pregnancy status, or any other status protected by law. We're happy to provide reasonable accommodations to those with a disability for assistance in the application process. Please email [email protected] and we'll discuss your specific situation and next steps (NOTE: this email does not accept or consider resumes or applications. This is only for disability assistance. To be considered for a position at Flex, you must complete the application process first).

Skills Required

  • Bachelor's degree in Manufacturing Engineering, Mechanical Engineering, Materials Engineering, Electrical Engineering, or a related technical discipline.
  • 3-5 years of hands-on experience in PCBA manufacturing.
  • Strong knowledge of the complete SMT process, including solder paste printing, pick-and-place, reflow soldering, wave soldering, AOI, SPI, X-ray inspection, and process optimization for high-volume production.
  • Experience supporting complex PCBAs with large BGAs, high-density assemblies, and advanced packaging technologies.
  • Ability to troubleshoot voiding, head-in-pillow, bridging, warpage, insufficient solder, and BGA-related manufacturing defects.
  • Strong understanding of PCBA materials, solder chemistry, thermal management, mechanical interactions, and reliability considerations.
  • Working knowledge of DFM, DFA, IPC standards, PFMEA, control plans, and manufacturing validation methodologies.
  • Experience supporting NPI programs from development through successful production ramp.
  • Experience supporting AI servers, accelerator cards, GPU-based platforms, rack-scale computing, or data center infrastructure products.
  • Strong analytical, problem-solving, and cross-functional collaboration skills in a fast-paced manufacturing environment.
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The Company
HQ: Austin, Texas
52,479 Employees
Year Founded: 1969

What We Do

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