Package Development Senior Manager

Posted Yesterday
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Seremban, Negeri Sembilan, MYS
In-Office
Senior level
Semiconductor
The Role
Lead package platform and backend assembly roadmap and development from concept to mass production. Resolve technical issues, ensure manufacturable, cost-effective solutions, drive cross-functional collaboration, continuous improvement, stakeholder management, and coach team members to grow technical capability.
Summary Generated by Built In

This role is part of the Package Development team, responsible for leading backend assembly and package platform development, including defining and executing technology roadmaps aligned with business and product needs. The role drives development from concept to mass production, ensuring reliable, manufacturable, and cost-effective solutions.
 

It involves resolving technical challenges, driving cross-functional collaboration, and supporting continuous improvement and new technology development. The role also includes stakeholder management and coaching team members to build technical capability and support career growth.
 

What you will do

  • Leads the strategic definition and execution of package platform and backend assembly technology roadmaps, ensuring alignment with business objectives and product innovation needs.

  • Drives the development and qualification of assembly packaging solutions from concept to mass production.

  • Support teams to achieve project goals by clearing technical roadblocks.

  • Accountable for delivering reliable, manufacturable, and cost-effective package solutions, while influencing key technology decisions and enabling competitive advantage.

  • Acting as a technical leader, the role ensures strong cross-functional collaboration, drives continuous improvement, and identifies future-ready assembly technologies to sustain long-term growth.

  • Ensure good communication and stakeholder management.

  • Coaching and develop team’s technical competence and career growth.

What you will need

  • Bachelor’s Degree/Master in Engineering.

  • At least 10 years of relevant experience in the semiconductor industry, with a minimum of 3 years in a managerial capacity.

  • The incumbent is also expected to have comprehensive knowledge on assembly process, BOM, design and equipment technologies related to semiconductor packaging.

  • Technical skill : Package design rule review, Thermal and stress FEA simulation , DFMEA, PFMEA , DFx (DFM, DFA, DFR) , AutoCAD, root cause analysis, DFPC, analytical tool

  • Strong leadership , ability to coach others.

  •  Able to actively build up and broaden own competencies and contacts, share into the organization.  Keeping up to date with state of the art packaging, material and process developments.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

Skills Required

  • Bachelor's or Master's degree in Engineering
  • At least 10 years relevant semiconductor industry experience
  • Minimum 3 years in a managerial capacity
  • Comprehensive knowledge of assembly process, BOM, design and equipment technologies for semiconductor packaging
  • Package design rule review
  • Thermal and stress FEA simulation experience
  • DFMEA and PFMEA experience
  • DFx practices (DFM, DFA, DFR)
  • DFPC experience
  • AutoCAD proficiency
  • Root cause analysis skills
  • Experience with analytical tools for packaging development
  • Strong leadership and ability to coach others
  • Willingness to broaden competencies and stay current with packaging, materials, and process developments
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The Company
Cabuyao, Laguna
3,887 Employees

What We Do

Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications. The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power and performance. Nexperia's commitment to innovation, efficiency, sustainability, and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards. For questions or more information about our career opportunities: [email protected] Connect with us today and become a part of TeamNexperia! Nexperia - Efficiency Wins.

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