Lead the development, qualification, and manufacturing release of advanced flip-chip packaging solutions, including substrate-based (FC-BGA, FC-LGA) and leadframe-based technologies. Drive package development from concept through production while working closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and suppliers to deliver high-performance, reliable, and cost-effective products.
Responsibilities- Lead package development activities from concept, design, qualification, and production release.
- Develop and optimize substrate-based and leadframe-based flip-chip package technologies.
- Drive package architecture, material selection, assembly process development, and manufacturability improvements.
- Support flip-chip integration, including bumping, underfill, reflow, molding, and singulation process optimization.
- Develop qualification plans and assess package reliability performance.
- Lead root-cause investigations and corrective actions for package, assembly, and reliability issues.
- Collaborate with OSATs and suppliers on process development, yield improvement, and cost reduction initiatives.
- Support NPI execution and transfer technologies into high-volume manufacturing.
- BS/MS in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
- 8+ years of semiconductor package development experience.
- Strong expertise in:
- Flip-chip packaging technologies
- FC-BGA and FC-LGA packages
- FC-QFN, FC-DFN, DrMOS, and SPS packages
- Leadframe and substrate packaging processes
- Package reliability and qualification
- Knowledge of DOE, DFMEA, SPC, 8D, and statistical problem-solving methodologies.
- Experience working with OSATs, substrate suppliers, and material vendors.
- Strong technical leadership and project management skills.
- Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.
- Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
- Proven ability to lead projects across organizations and cultures in a fast-paced environment.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
Skills Required
- Bachelor’s or master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field
- 8 or more years of semiconductor package development experience
- Expertise in flip-chip packaging technologies
- Experience with FC-BGA and FC-LGA packages
- Experience with FC-QFN, FC-DFN, DrMOS, and SPS packages
- Knowledge of leadframe and substrate packaging processes
- Experience with package reliability and qualification
- Knowledge of DOE, DFMEA, SPC, 8D, and statistical problem-solving methodologies
- Experience working with OSATs, substrate suppliers, and material vendors
- Strong technical leadership and project management skills
- Strong communication and cross-functional collaboration skills
- Proficiency with ACAD, 8D, SPC, DFMEA, and DOE
- Ability to lead projects across organizations and cultures in a fast-paced environment
onsemi Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about onsemi and has not been reviewed or approved by onsemi.
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Retirement Support — Retirement programs are highlighted by a U.S. 401(k) with a 100% match on the first 4% and immediate vesting. International plans such as Ireland’s defined contribution scheme and Germany’s company-funded pension elements reinforce long-term savings.
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Leave & Time Off Breadth — Time-off policies include ten paid holidays, flexible vacation for exempt employees, and three to five weeks of vacation for non-exempt staff as tenure grows, alongside sick time accrual. Paid leaves span parental, bereavement, jury duty, and military service, with Europe locations offering additional statutory and seniority-based days.
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Parental & Family Support — Family supports include eight weeks of paid parental leave, company-sponsored backup care for children, adults, and pets, and up to $15,000 in adoption assistance. Regional provisions such as Switzerland’s child allowance and accessible EAP counseling show added attention to household needs.
onsemi Insights
What We Do
We are building a better future through intelligent technology. For over 60 years, onsemi and its ancestors have been leading the world’s greatest technology advancements. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
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