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Job Description:Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.
RESPONSIBILITIES:
Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.
Schedule, prioritize, & track your work across 2+ projects simultaneously
General flip-chip BGA package design & engineering
Project management and customer interface for your design projects
Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc.
Physical design (layout) is a foundational responsibility in this role
EDUCATION/EXPERIENCE & REQUIREMENTS:
BSEE or similar field and 8+ years’ experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 6+ years’ work experience
Knowledge of package-level signal integrity and power integrity, to apply to package designs
Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.
Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
Self-management and organization skills
Preferred candidates will also have 1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest
OTHER REQUIREMENTS
This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position.
Compensation and Benefits
The annual base salary range for this position is USD 121,900.00 To USD 195,000.00
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Skills Required
- BSEE with 8+ years or MSEE with 6+ years experience in flip-chip BGA package design
- Experience with high-speed SerDes and package-level signal integrity and power integrity
- Flip-chip BGA package design and physical layout experience
- Project management and customer/vendor interface experience; manage multiple projects concurrently
- Ability to work on-site 5 days a week at Broadcom office
- Self-management, organization skills, and ability to collaborate across global teams/time zones
- Cadence APD / Allegro Package Designer experience (or equivalent tool)
- 1+ years Cadence SKILL or similar design-automation scripting experience
Broadcom Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.
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Equity Value & Accessibility — Equity is used broadly through RSUs with quarterly or annual vesting, and an ESPP with a discount and look‑back that can add meaningful upside. Company disclosures show ongoing equity grants, including inducement RSUs tied to acquisitions, underscoring equity’s central role in total rewards.
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Retirement Support — A 401(k) plan with a competitive company match and immediate vesting is consistently highlighted, supporting long‑term savings. Tax‑advantaged accounts like HSA/FSA further strengthen the financial wellness toolkit.
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Pay Growth & Progression — Compensation ceilings in technical tracks are described as high, with wide ranges and very strong totals for experienced engineers. Sales compensation is also characterized as competitive, supporting attractive on‑target earnings.
Broadcom Insights
What We Do
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.
