Own and support high-volume semiconductor manufacturing equipment and processes that enable advanced device scaling and the production of integrated circuits.
This role is responsible for ensuring process stability, equipment performance, and continuous improvement within a high-volume manufacturing environment.
Key Responsibilities
- Own critical manufacturing equipment and processes that support advanced semiconductor fabrication.
- Conduct process monitoring, testing, and measurements to maintain control of critical dimensions, defectivity, and overall process performance.
- Identify, recommend, and implement equipment and process improvements to enhance safety, quality, productivity, yield, and cost performance.
- Drive continuous improvement initiatives and key performance indicators (KPIs), including safety, quality, cost, productivity, defect reduction, and yield enhancement.
- Support the ramp-up of manufacturing capacity and technology transfer activities to high-volume production sites worldwide.
- Own and coordinate equipment maintenance, repair, and reliability activities within the assigned module.
- Partner with equipment suppliers and cross-functional teams to resolve technical issues and improve equipment performance.
- Lead process development activities aligned with current and future high-volume manufacturing technology nodes.
- Support technology transfer activities through training, audits, installation reviews, and qualification assessments to ensure process matching across global manufacturing sites.
- Develop and optimize excursion prevention and detection systems to improve process control and reduce manufacturing risk.
- Identify and resolve equipment and process discrepancies to minimize impact on production.
- During factory ramps, lead equipment installation, conversion, qualification, and readiness activities to ensure tools are installed safely, on schedule, and in compliance with all quality and manufacturing requirements.
Current Openings
Opportunities are available within the following fabrication process modules:
- Dry Etch
- Thin Films
- Lithography Tracks
- Defect Metrology
- Thin Films Metrology
Minimum Qualifications:
Candidates must possess one of the following:
- Bachelor's degree or higher in Chemistry, Materials Science, Physics, Chemical Engineering, or a related STEM field and 3+ years of semiconductor device fabrication or semiconductor manufacturing experience.
OR
- Master's degree in Chemistry, Materials Science, Physics, Chemical Engineering, or a related STEM field and 1+ year of semiconductor device fabrication or semiconductor manufacturing experience.
Preferred Qualifications:
- Experience supporting semiconductor process modules such as Dry Etch, Thin Films, Lithography, or Metrology.
- Strong data analysis, troubleshooting, and problem-solving skills.
- Experience with process optimization, equipment improvement, and yield enhancement initiatives.
- Ability to work effectively across engineering, manufacturing, and supplier organizations in a fast-paced production environment.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, New Mexico, AlbuquerqueAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $103,730.00-146,440.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree or higher in Chemistry, Materials Science, Physics, Chemical Engineering, or a related STEM field, plus 3 or more years of semiconductor device fabrication or semiconductor manufacturing experience.
- Master's degree in Chemistry, Materials Science, Physics, Chemical Engineering, or a related STEM field, plus 1 or more years of semiconductor device fabrication or semiconductor manufacturing experience.
- Experience supporting semiconductor process modules such as dry etch, thin films, lithography, or metrology.
- Strong data analysis, troubleshooting, and problem-solving skills.
- Experience with process optimization, equipment improvement, and yield enhancement initiatives.
- Ability to work effectively across engineering, manufacturing, and supplier organizations in a fast-paced production environment.
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
Intel Insights
What We Do
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone.








