Who We Are
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.
What We Offer
Salary:
$140,000.00 - $192,500.00Location:
Albany,NYYou’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.
At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.
Key Responsibilities
Develop advanced packaging modules using Applied Materials’ equipment portfolio and advise the Packaging Business Unit on equipment requirements.
Drive new materials and process development for logic, DRAM, and NAND through structured problem solving and experimentation.
Provide domain expertise in W2W and D2W bonding, micro-bumps, TSVs, thermal and stress management, optics, and multi-wafer stacking, with deep knowledge of materials, processes, device physics, and integration.
Design and tape out test vehicles for internal development and customer programs.
Define engineering plans and DOEs, lead characterization, and prepare technical reports.
Improve packaging interconnect performance by reducing RC delay and increasing wiring density across polymer and thin-film dielectrics.
Solve complex technical challenges through innovative and novel approaches.
Identify patentable innovations and support intellectual property filings.
Serve as the IMS module expert to internal business units and external customers, leading cross-functional initiatives across Applied Materials.
Develop packaging roadmaps, lead application committees, and guide product portfolio strategy in alignment with industry trends.
Qualifications
Bachelor’s or master’s degree in electrical, mechanical, or materials engineering, or a related field; PhD preferred.
10+ years of semiconductor packaging development and manufacturing experience.
Strong communication and collaboration skills across business units, manufacturing organizations, and customers.
Proven ability to lead global, cross-functional projects in a fast-paced environment.
Self-motivated team player who works effectively with minimal supervision.
Leadership Competencies
Applies industry and commercial expertise to improve business performance.
Leads through influence, executes business plans, and contributes to strategy.
Resolves complex challenges through advanced analysis and sound judgment.
Influences business results and enables cross-functional teams.
Communicates and negotiates effectively with executives and external partners.
Requires full compliance with Applied Materials’ Standards of Business Conduct, ethical standards, and core values.
Additional Information
Time Type:
Full timeEmployee Type:
Assignee / RegularTravel:
Yes, 10% of the TimeRelocation Eligible:
YesThe salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at [email protected], or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.
Skills Required
- Experience integrating devices in FEOL and BEOL processing and wafer-level packaging, including end-to-end technology development (process assumptions, ground rule generation, tape-out, test site coordination, scheduling, setup, installation, route pipe cleaning, wafer processing logistics, test, characterization, and process debug).
- Understanding of measurement techniques to characterize physical and electrical material properties, with demonstrated experience in at least one technique.
- Working understanding of semiconductor devices (Diodes, Transistors, MOS, MIM, etc.).
- Understanding of relationship between device design, material composition, and functional behavior.
- Working understanding of techniques to characterize integrated device structures (reliability, construction analysis, functional circuit characterization).
- Hands-on experience in semiconductor and packaging process environments.
- Ability to work in team-oriented, collaborative environments.
- Strong presentation and oral communication skills for internal, executive, and external customer communications.
Applied Materials Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Applied Materials and has not been reviewed or approved by Applied Materials.
-
Healthcare Strength — Company materials emphasize comprehensive medical, dental, vision, mental health, and wellness programs for employees and families, with coverage beginning on day one in many cases. On-site or virtual care options at major campuses further reinforce the breadth of support.
-
Leave & Time Off Breadth — Exempt employees are offered a Flexible Time Off program and U.S. teams observe 11 paid company holidays. These policies are consistently highlighted across official benefits summaries.
-
Equity Value & Accessibility — An Employee Stock Purchase Plan is widely available and presented as a core part of the U.S. package, alongside equity grants in many roles. These ownership elements are positioned as meaningful contributors to total rewards.
Applied Materials Insights
Similar Jobs
.png)
What We Do
Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations make possible a better future.
