Join Intel as a Module Development Engineer, where you will play a critical role in driving technology development and enabling advanced manufacturing solutions. In this position, you will lead the design and optimization of complex manufacturing processes, including material selection and equipment development, to enable innovative product designs and high-volume production. Your work will directly impact Intel's ability to maintain its leadership in cutting-edge semiconductor technologies.
Business group
As part of Intel Foundry, you will join a dynamic team focused on advancing semiconductor manufacturing technologies and capabilities. The group's mission includes enabling high-volume production through innovative process integration, equipment solutions, and technology advancements. Collaborating across Intel's global network, you will contribute to driving Intel's success in delivering transformative technologies to its customers.
Key Responsibilities
- Lead the development of manufacturing processes that include MHS equipment development, parameter optimization, and equipment metrology.
- Perform pathfinding activities to enable emerging device architectures and support process and hardware development.
- Develop roadmaps for future technologies that align with Intel's leadership in semiconductor innovation.
- Collaborate with equipment and materials suppliers to implement solutions that meet manufacturing and technology needs.
- Recommend and execute modifications to equipment and processes to improve efficiency and optimize production output.
- Stay informed about industry trends in materials and manufacturing processes, identifying opportunities for innovation.
Behavioral Traits
- Strong problem-solving skills, adaptability, and ability to manage multiple tasks simultaneously.
- Passionate about advancing Intel's strategic goals and driving meaningful industry advancements.
- Strong collaboration skills to work effectively across multidisciplinary teams.
Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, Chemistry, Organic Chemistry, Polymer Engineering, or related fields, with 3+ years of relevant experience OR Master's degree in the above fields with 2+ years of relevant experience OR PhD in the above fields with no prior professional experience required.
- Experience mentioned above should be a combination of the following:
- Semiconductor processing, process development, or working in cleanroom environments
- Proficiency in statistical methods, such as Statistical Process Control (SPC) and Design of Experiments (DOE).
- Experience in wafer-level assembly module engineering or fab process/hardware technology development.
Preferred Qualifications
- Familiarity with semiconductor packaging and assembly technologies.
- Troubleshoot complex manufacturing processes and apply structured problem-solving methods.
- Experience with advanced process control systems and data analysis tools like JMP software.
This is your chance to shape the future of semiconductor technology and make a lasting impact. Apply today and become an integral part of Intel's innovative and forward-thinking team.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-162,500.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, Chemistry, Organic Chemistry, Polymer Engineering, or a related field, plus 3 or more years of relevant experience
- Master's degree in a listed or related field, plus 2 or more years of relevant experience
- PhD in a listed or related field; no prior professional experience required
- Experience with semiconductor processing, process development, or cleanroom environments
- Proficiency with statistical methods including Statistical Process Control and Design of Experiments
- Experience in wafer-level assembly module engineering or fab process and hardware technology development
- Familiarity with semiconductor packaging and assembly technologies
- Experience troubleshooting complex manufacturing processes using structured problem-solving methods
- Experience with advanced process control systems and JMP software
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
Intel Insights
What We Do
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone.
