Join Intel - and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Join us and help us create the next generation of technologies that will shape the future for decades to come.
Engineers within Intel's Logic Technology Development (LTD) organization are chartered with continuing to meet the challenge of Moore's Law in the 21st century. We innovate leading edge fabrication processes and continue to overcome seemingly impossible barriers as tolerances and specifications for building best-in-class computing devices become increasingly rigorous.
The role of a Chemical Mechanical Planarization (CMP) Process Development Engineer in LTD encompasses developing and sustaining planarization techniques for a variety of materials and architectures, enabling rapid miniaturization in the semiconductor industry and the mass production of integrated circuits. CMP techniques leverage physics, chemistry, materials science and surface science concepts, and exist at the intersection of these disciplines. As a result, our team has a diverse set of scientific backgrounds that relies on strong collaboration and shared learning.
The role’s responsibilities include, but are not limited to:
Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications
Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements
Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap
Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products
Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology
Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods
Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap
You must possess the minimum qualifications below to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications:
PhD degree in Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Material Science, Physics, Chemistry, Computer Science, or a Semiconductor-related STEM (Science Technology Engineering Math) field of study (with a focus on hands-on experimental research).
Preferred Qualifications:
Statistics Coursework, Statistical Process Control (SPC) or Design of Experiments (DOE) principles, and engineering analysis tools
Experimental lab work
Semiconductor and transistor device physics
Advanced transistor device structures and architectures including fabrication (e.g., lithography, etch, film deposition, cleans, chemical-mechanical planarization, etc.) with in-depth knowledge of semiconductor device physics and process integration
Data analysis skills with demonstrated ability to construct clear data-based problem statements
Semiconductor processing fundamentals (lithography, wet etch, dry etch, chemical and or mechanical polishing, etc.)
Design of experiments
Materials and physical device characterization (SEM, TEM, etc.) and fundamentals of semiconductor device testing
Statistical, data analysis (MATLAB, Excel, JMP, etc.)
Must be able to start within 12 months
For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information
Job Type:College GradShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- PhD in Electrical Engineering, Electrical and Computer Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, Computer Science, or a semiconductor-related STEM field with hands-on experimental research focus
- Statistics coursework, Statistical Process Control, or Design of Experiments principles
- Engineering analysis tools
- Experimental laboratory experience
- Semiconductor and transistor device physics knowledge
- Knowledge of advanced transistor structures, semiconductor fabrication, and process integration
- Data analysis skills and ability to construct data-based problem statements
- Knowledge of semiconductor processing fundamentals, including lithography, etch, deposition, cleaning, and polishing
- Design of experiments experience
- Materials and physical device characterization experience, including SEM or TEM
- Statistical and data analysis experience using MATLAB, Excel, JMP, or similar tools
- Ability to start within 12 months
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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