KYOCERA SLD Laser, Inc. (KSLD) is a global leader in the commercialization of gallium nitride (GaN) based laser light sources. As a wholly owned subsidiary of KYOCERA Corporation, KSLD combines advanced laser innovation with the strength, scale, and manufacturing excellence of a global technology leader.
KSLD develops and manufactures high performance LaserLight™ solutions engineered to deliver exceptional brightness, efficiency, and reliability. Our GaN laser technologies enable a wide range of applications, including automotive and mobility, specialty and portable lighting, projection and AR/VR displays, biomedical instrumentation, industrial imaging, and emerging communication technologies such as LiFi. With vertically integrated capabilities and deep technical expertise, KSLD collaborates closely with customers to deliver application specific laser solutions, accelerating development timelines from concept through production. The company operates advanced R&D and manufacturing facilities in Santa Barbara, CA and Fremont, CA, supporting both innovation and high volume manufacturing needs.
KSLD is ISO 9001 certified and IATF 16949 compliant for automotive applications, and its products meet rigorous UL and IEC safety standards, reflecting a strong commitment to quality, safety, and reliability.
Recognized by Fortune magazine’s Best Workplaces in Manufacturing & Production™, KSLD fosters an employee centric culture built on collaboration, technical excellence, and continuous innovation. Guided by a mission to engineer the future of light, KSLD develops laser based solutions that power next generation mobility, consumer, specialty lighting, and industrial technologies.
KSLD will continue to pioneer the future of light by developing, manufacturing and marketing innovative laser based products with high efficiency and luminance for mobility, specialty lighting, consumer, and industrial applications.
To learn more about KSLD, visit www.kyocerasldlaser.com or contact the company at [email protected] or 18667535273.
QualificationsJob Description
We are seeking a highly motivated Mechanical Engineer with strong expertise in thermal and thermal mechanical simulations, solder materials and attach processes, wire bond process and epoxy materials to support the design, development, and reliability of advanced products. This role will focus on thermal management, materials selection, and process development to ensure robust performance and manufacturability.
The ideal candidate will have hands-on experience with thermal modeling tools, a deep understanding of heat transfer, and practical knowledge of soldering and adhesive systems used in high-performance assemblies.
Key Responsibilities
* Perform thermal simulations and analyses (steady-state and transient) to optimize product performance and reliability
* Develop and validate thermal models using tools of Solidworks Simulation (FEA), Solidworks Flow Simulation (CFD) or equivalent tools experiences, such as ANSYS, COSMCOL etc.
* Design and evaluate thermal management solutions (heat sinks, interfaces, TIMs, cooling strategies)
* Lead or support solder attach process development, including die attach, component attach, and reflow processes
* Support wire bond process development by defining tools, wires and process parameters to meet product performance and reliability requirements.
* Select and qualify epoxies and adhesive materials for structural bonding, encapsulation, and thermal interface applications
* Collaborate with cross-functional teams (electrical, materials, manufacturing, reliability) to ensure design integration.
* Conduct failure analysis and root cause investigations, with a focus on thermal and material-related issues
* Define and execute design validation tests (DVT), including thermal cycling, shock, and environmental testing
* Support manufacturing scale-up by developing process specifications, work instructions, and quality criteria
* Analyze test data and provide recommendations for design and process improvements
Required Qualifications
* Bachelor’s or Master’s degree in **Mechanical Engineering** or related field
* 3–8+ years of relevant industry experience
* Strong understanding of heat transfer principles (conduction, convection, radiation) and key factors of a real thermal system to be able to convert it to a solvable model and get a desired accurate result.
* Hands-on experience with thermal simulation tools (e.g., Solidworks Simulation, SolidWorks Flow Simulation, ANSYS, COMSOL…)
* Experience with solder attach processes (die attach, SMT, reflow profiles, reliability concerns such as intermetallic compound formation, voiding, fatigue)
* Knowledge of epoxies and adhesives, including material properties, curing mechanisms, and application methods
* Knowledge of hermetic packages, hermeticity definition, as well as how to design it, manufacture it and test it.
* Familiarity with thermal interface materials (TIMs) and packaging concepts
* Experience with lab testing and instrumentation (thermocouples, IR cameras, data acquisition)
* Strong analytical and problem-solving skills
Preferred Qualifications
* Experience in semiconductor packaging, optoelectronics, or high-power electronics
* Knowledge of DFM (Design for Manufacturability) and DFR (Design for Reliability)
* Background in finite element analysis (FEA) for structural and thermo-mechanical modeling
* Understanding of materials reliability, including CTE mismatch, fatigue, and creep
* Experience with failure analysis techniques (cross-sectioning, microscopy)
* Familiarity with industry standards (MIL, ISO, IATF)
* Programming or scripting skills (Python, MATLAB, JMP) for data analysis
* Experience working in a fast-paced, cross-functional development environment
Key Competencies
* Strong technical depth in thermal and materials engineering
* Ability to translate simulation results into practical design improvements
* Effective communication and collaboration skills
* Detail-oriented with a focus on quality and reliability
* Self-driven and capable of managing multiple priorities
The full-time base salary range for the Mechanical Engineer position is $93,000 to $110,000 per annum. The range reflects the minimum and maximum possible base salary for new hires for the role, based on the advertised location. Individual pay is determined by several factors including work location, job-related skills, experience, and relevant education and training. For more information about the base salary range applicable to the work location, talk to the recruiter.
Kyocera SLD Laser, Inc. is an equal opportunity employer. We do not discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, legally protected medical condition, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by local, state, or federal laws
The above statements are intended to describe the general nature and level of work being performed by people assigned to this job. They are not intended to be an exhaustive list of all responsibilities, duties, and requirements of personnel as classified.
Skills Required
- Bachelor's or Master's degree in Mechanical Engineering or a related field
- 3-8+ years of relevant industry experience
- Strong understanding of heat transfer principles, including conduction, convection, and radiation
- Hands-on experience with thermal simulation tools such as SolidWorks Simulation, SolidWorks Flow Simulation, ANSYS, or COMSOL
- Experience with solder attach processes, including die attach, SMT, reflow profiles, intermetallic compound formation, voiding, and fatigue
- Knowledge of epoxies and adhesives, including material properties, curing mechanisms, and application methods
- Knowledge of hermetic packages, hermeticity design, manufacturing, and testing
- Familiarity with thermal interface materials and packaging concepts
- Experience with laboratory testing and instrumentation, including thermocouples, infrared cameras, and data acquisition
- Strong analytical and problem-solving skills
- Experience in semiconductor packaging, optoelectronics, or high-power electronics
- Knowledge of Design for Manufacturability and Design for Reliability
- Background in finite element analysis for structural and thermo-mechanical modeling
- Understanding of materials reliability, including CTE mismatch, fatigue, and creep
- Experience with failure analysis techniques such as cross-sectioning and microscopy
- Familiarity with MIL, ISO, and IATF industry standards
- Programming or scripting skills using Python, MATLAB, or JMP for data analysis
- Experience working in a fast-paced, cross-functional development environment
What We Do
KYOCERA SLD Laser, Inc. (KSLD) is a wholly owned subsidiary and group company of KYOCERA Corporation, commercializing a new generation of gallium nitride based laser light sources for automotive, mobility, specialty lighting, and consumer applications. The company is ISO 9001 certified and automotive compliant to IATF 16949, and operates facilities in Santa Barbara, CA, and in Fremont, CA. KSLD’s high luminance LaserLight™ sources are UL and IEC safety certified and are utilized in a myriad of applications including automotive & mobility, specialty & portable lighting, entertainment & outdoor, projection & AR/VR displays, biomedical instrumentation & therapeutics, and industrial imaging & material processing. The company was recently ranked in Fortune magazine’s “2021 Best Workplaces in Manufacturing & Production™,” having promoted an employee-centric corporate culture since its founding. To learn more about KSLD, visit www.kyocera-sldlaser.com or contact the company at [email protected] or 1-866-753-5273. Our technology incorporates a revolutionary semi-polar GaN laser technology, creating industry-leading performance and reliability. With a robust intellectual property portfolio, including 400 patents, our visible laser sources have no equals. SLD Laser's visible laser light sources are used directly in single color and R-G-B applications, or integrated into laser pumped phosphor architectures. These sources enable applications in a myriad of vertical markets, including Automotive, Display, Specialty Illumination, Biomedicine, Industrial Materials, and Defense and Security.






