This position is in the Logic Technology Development team working in one of the most advanced semiconductor process technologies in the world. You will design, execute, and analyze experiments to develop the process of the next technologies to come into the market. Come join us and help shape the future of the semiconductor process for decades to come.
What we offer:
We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We give you opportunities to transform technology and create a better future, by delivering products. Intel Corporation Core Values here.
Benefits:
We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work! Find more information about our Amazing Benefits here.
What we do:
The Logic Technology Development (LTD) organization delivers the latest process technology innovations to drive Intel's amazing product roadmap. Look at Life Inside Intel here.
What you will be considered for:
LTD Semiconductor Senior Process Integration Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to:
- Lead scientific research enabling the manufacture of innovative device architectures coupled with the realization of these architectures.
- Designing, executing, and analyzing experiments necessary to meet engineering specifications for their process.
- Participate in the development of intellectual property.
- Integrate the many individual steps necessary for the manufacture of complex microprocessors.
- Ramp to manufacturing volumes to demonstrate the technology meets requirements while simultaneously transferring the technology to counterparts in manufacturing via the Copy Exactly Methodology.
You must possess the minimum qualifications below to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- The candidate must possess a Bachelor's degree with 4+ years, Master's degree with 3+ years, or a Ph.D. degree with 2+ years of experience in Materials Science, Chemical Engineering, Chemistry, Physics, Mechanical Engineering, Electrical Engineering, or a related Scientific STEM (Science Technology Engineering Math) field of study.
- Semiconductor processing, Semiconductor fabrication, or nanotechnology.
- Design of experiments
- Statistical Process Control (SPC)
- Computational Data Skills
Process Development Requirements
- Must satisfy experience in one of the following areas:
- 2+ years of professional overlay development experience and understanding of process induced overlay impacts
- 2+ years of professional scanner, track, or lithography metrology tool experience
- 2+ years of professional lithography process layer development experience.
- Proven experience with integrated process development
- Proven experience troubleshooting process impacts to lithography equipment, layer, or overlay mark performance
- Proven experience driving integrated process change methodologies to develop a robust process
- Demonstrated ability to utilize coding to facilitate data collection and analysis
- Equipment development and vendor interaction experience is a plus
- Experience with ASML scanner EUV and DUV platforms is a plus
- Ability to troubleshoot complex production issues and optimize application performance and reliability
- Strong communication skills and the ability to work effectively in cross-functional development teams
Factory Requirements
- Understanding of modern semiconductor manufacturing processes
- Working knowledge of how modern lithography equipment operates, including the automation systems used to control it
- Familiarity with factory automation or manufacturing control systems is a plus
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Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree in Materials Science, Chemical Engineering, Chemistry, Physics, Mechanical Engineering, Electrical Engineering, or related STEM with 4+ years experience (or Master's with 3+ years, Ph.D. with 2+ years).
- Semiconductor processing, semiconductor fabrication, or nanotechnology experience.
- Design of Experiments (DOE) experience.
- Statistical Process Control (SPC) experience.
- Computational data skills (data analysis) and demonstrated ability to utilize coding for data collection and analysis.
- 2+ years professional overlay development experience and understanding of process-induced overlay impacts.
- 2+ years professional scanner, track, or lithography metrology tool experience.
- 2+ years professional lithography process layer development experience.
- Proven experience with integrated process development.
- Proven experience troubleshooting process impacts to lithography equipment, layer, or overlay mark performance.
- Proven experience driving integrated process change methodologies to develop robust processes.
- Equipment development and vendor interaction experience.
- Experience with ASML scanner EUV and DUV platforms.
- Ability to troubleshoot complex production issues and optimize application performance and reliability.
- Strong communication skills and ability to work effectively in cross-functional development teams.
- Understanding of modern semiconductor manufacturing processes.
- Working knowledge of how modern lithography equipment operates, including automation systems used to control it.
- Familiarity with factory automation or manufacturing control systems.
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
Intel Insights
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