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Job Description:Job Description
1. R&D engineer position available in design and physical implementation of high-performance System-On-Chip ASICs. Key competencies required are:
- Working experience leading team in physical design implementation of large ASICs (500 to 800 million gates complexity).
- Demonstrated ability in providing technical support to customers and managing customer working relationship.
- Demonstrated strong technical hands-on competency in using leading edge physical design EDA tools in projects.
- In-depth CPU/DSP architecture/algorithm working knowledge and related physical design implementation knowledge highly advantageous.
- Collaborating with RTL and Physical Design teams to resolve timing violations through design or constraint optimization.
2. Utilize commercial and in-house EDA tools for the design and implementation of 500 ~ 800 million gate integrated circuits in 5nm/3nm/2nm process technologies.
3. Opportunity to participate in innovation, design flow and methodology development to address challenges of designing into deep submicron processes and state-of-the-art ASIC design for computing and networking products
Qualifications: Requirements
1. Degree, Masters or PhD in Electrical/Electronics/Computer engineering with 8 years or more experience in a relevant field.
2. Familiarity with one or more VLSI design tools (Cadence, Synopsys, Mentor & Ansys) for Place & Route, Spice Simulation, DRC/LVS Physical Verification, Static Timing Analysis and Power Integrity
3. Strong analytical problem-solving skills and the ability to collaborate in cross-functional team environments
4. Experience in Perl, Tcl & Python Scripting languages
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Skills Required
- Degree, master's, or PhD in Electrical, Electronics, or Computer Engineering
- At least 8 years of experience in a relevant field
- Experience leading physical design implementation teams for large ASICs
- Experience with VLSI design tools such as Cadence, Synopsys, Mentor, or Ansys
- Experience with place and route, SPICE simulation, DRC/LVS physical verification, static timing analysis, and power integrity
- Experience with Perl, Tcl, and Python scripting languages
- Strong analytical and problem-solving skills
- Ability to collaborate in cross-functional team environments
- Customer technical support and customer relationship management experience
- CPU/DSP architecture and algorithm knowledge
Broadcom Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.
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Equity Value & Accessibility — Equity awards such as RSUs and an ESPP can substantially increase total compensation, particularly in technical and senior roles. Stock-based pay is often a major component of earnings and can make offers especially attractive when shares perform well.
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Retirement Support — A 401(k) match reportedly up to 6% with immediate vesting strengthens long-term savings. This feature provides clear value for employees prioritizing retirement contributions.
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Healthcare Strength — Offerings include medical, dental, vision, mental-health coverage and HSA/FSA options, alongside fertility, adoption, childcare benefits, and caregiver leave. This breadth signals a comprehensive set of health and family supports.
Broadcom Insights
What We Do
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.






