Hardware Product Manager - Smart Ring

We are building a smart ring for. This role owns hardware execution end to end, working closely with ODM/CM partners.

Responsibilities

• Own the smart ring hardware system and electrical architecture:

  • BLE SoC / MCU

  • PPG, IMU, temperature sensors

  • Microphone and audio front end

  • Battery, PMIC, and wireless charging

• Work directly with ODM engineers on schematics, PCB layout, and design trade-offs (size, power, RF, cost).

• Lead power, RF, and sensor performance validation in real-world use.

• Bring up and debug EVT/DVT prototypes; troubleshoot power, RF, sensor, and audio issues using lab tools.

• Drive fast design iterations while ensuring DFM/DFT readiness.

• Define hardware test coverage for EVT/DVT/PVT and review factory test fixtures and processes.

• Support NPI, analyze build data, and drive fixes through to mass production.

• Act as the China-side hardware owner, keeping HQ and factories aligned on risks, decisions, and timelines.

Requirements

• 5+ years of consumer electronics hardware experience, ideally wearables or small devices.

• Strong in low-power BLE systems, mixed-signal design, and battery-powered products.

• Hands-on with bring-up, debugging, and prototype validation.

• Experience working with China-based ODM/CMs and EVT/DVT/PVT cycles.

• Able to work closely with firmware teams and understand HW/FW trade-offs.

• PPG or health wearable experience.

• Microphone and audio chain experience in small form-factor devices.

• Smart ring, TWS, or jewelry-class electronics background.

• Mandarin and English proficiency.

我们正在打造一款新一代智能戒指，结合健康与运动监测，并支持按压式语音记录功能。该职位常驻中国，全面负责硬件落地与执行。总部负责产品定义与路线图，你负责让硬件在现实中真正可用，并与代工厂 / 组装厂紧密合作。

• 负责智能戒指整体硬件系统与电气架构，包括：

  • 低功耗 BLE SoC / MCU

  • PPG、IMU、温度传感器

  • 麦克风与音频前端

  • 电池、PMIC 与无线充电

• 与代工厂工程师直接合作，推进原理图、PCB 布局及关键设计取舍（尺寸、功耗、射频、成本）。

• 主导功耗、射频与传感器性能在真实使用场景下的验证。

• 负责 EVT / DVT 样机硬件带板与调试，使用实验室设备排查功耗、射频、传感器及音频问题。

• 在快速迭代设计的同时，确保 DFM / DFT 与量产可行性。

• 定义 EVT / DVT / PVT 阶段的硬件测试覆盖，并审核工厂测试夹具与流程。

• 支持 NPI 与量产导入，分析打样和量产数据，推动问题闭环解决。

• 作为中国端硬件负责人，保持总部与工厂在进度、风险和决策上的一致。

• 7 年以上消费电子硬件经验，优先可穿戴或小型设备背景。

• 熟悉低功耗 BLE 系统、混合信号设计及电池供电产品。

• 强动手能力，能独立完成样机带板与问题调试。

• 有中国代工厂 / 组装厂合作经验，熟悉 EVT / DVT / PVT 流程。

• 能与固件团队紧密配合，理解软硬件取舍。

• 健康可穿戴或 PPG 生物传感经验。

• 小型设备（如 TWS、可穿戴）麦克风与音频链路经验。

• 智能戒指或首饰类电子产品经验。

• 中英文工作沟通能力。