At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
We are actively seeking a Firmware Engineer Lead, based in Pune.
Required Experience:
Experience developing embedded firmware for PCIe products.
High level of proficiency in C (preferred) or C++, including development of C-based SDKs.
High level of proficiency in Python for automating pre-processors/post-processors.
Working knowledge of software/firmware build environments, gcc/Make, Doxygen, and GitHub.
Hands-on experience with Server, Storage, and/or Networking equipment (e.g. Network Switches).
Familiarity with SoC interfaces to common IP blocks such as PCIe Controllers, NVME Controllers, AMBA/AHB interfaces, on-chip memory interfaces, and other similar interfaces
Direct experience working on products with high-speed interfaces common in Data Center equipment: PCI- Express (Gen-3 and above), 100/400G Ethernet, Infiniband, NVMe, etc
Preferred Experience:
Experience developing firmware to execute in on-chip microcontrollers as well as C-language SDKs to execute on system management controllers (e.g. BMC)
Experience with industry forums and collaboration workgroups such as OCP and OpenBMC
Experience with storage or SSD firmware, including NVMe, PCIe, CXL or flash management concepts.
Hands-on experience with simulation or virtual platform–based development (e.g., VDK, QEMU, or similar)
Qualifications:
Strong academic and technical background in electrical engineering. At a minimum, a Bachelor’s in EE or Computer Science is required, and a Master’s is preferred.
Minimum 12+ years’ (Lead/Architect) experience supporting or developing complex SoC/silicon products for Server, Storage, and/or Networking applications
Experience developing firmware to execute in on-chip microcontrollers as well as C-language software development kits (SDKs) to execute on system management controllers (e.g. BMC).
Experience working with logic designers to architect and verify HW-SW interfaces on complex SoCs.
If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!
https://www.kandou.ai/
Skills Required
- Embedded firmware development experience for PCIe products
- High proficiency in C or C++, including C-based SDK development
- High proficiency in Python for preprocessor and postprocessor automation
- Working knowledge of GCC, Make, Doxygen, and GitHub
- Hands-on experience with server, storage, or networking equipment
- Familiarity with PCIe controllers, NVMe controllers, AMBA/AHB interfaces, on-chip memory interfaces, and similar SoC interfaces
- Experience with high-speed data-center interfaces including PCIe Gen 3 or above, 100/400G Ethernet, InfiniBand, or NVMe
- Bachelor's degree in Electrical Engineering or Computer Science
- Minimum 12+ years of experience supporting or developing complex SoC or silicon products for server, storage, or networking applications
- Experience developing firmware for on-chip microcontrollers and C-language SDKs for system management controllers such as BMCs
- Experience collaborating with logic designers to architect and verify hardware-software interfaces on complex SoCs
- Master's degree in Electrical Engineering or Computer Science
- Experience with OCP and OpenBMC industry forums or collaboration workgroups
- Storage or SSD firmware experience, including NVMe, PCIe, CXL, or flash management concepts
- Experience with simulation or virtual-platform development using VDK, QEMU, or similar tools
What We Do
Kandou AI is a fabless semiconductor company developing high-speed connectivity for AI infrastructure. Its patented Copper MIMO, also known as Chord Signaling, sends correlated signals at data-processing speeds of 448 Gbps and beyond, providing an alternative to optical interconnects. The company’s technology targets AI data-movement bottlenecks and memory-wall constraints, while its platforms emphasize improved efficiency, lower power and cost, and scalability.
