Firmware Architect

Posted 6 Days Ago
Be an Early Applicant
2 Locations
Hybrid
Senior level
Artificial Intelligence • Hardware • Semiconductor
The Role
Define firmware architecture for high-speed 224G/lane AEC retimers, including boot, calibration, link training, equalization, FEC, telemetry, and standards compliance. Lead silicon bring-up from first samples through production while partnering with ASIC and signal-integrity teams. Implement IEEE 802.3ck/dj adaptation algorithms, PAM4 equalization, FEC integration, and predictive telemetry on constrained MCUs. The role requires embedded C, assembly, Python tooling, RTOS experience, hardware-in-loop testing, and up to 15% travel.
Summary Generated by Built In

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.

We are actively seeking a Firmware Architect either based in Hyderabad OR Bangalore.
Responsibilities:

  • Define firmware architecture for 224G/lane AEC retimer (boot, config, calibration, link training, equalization, FEC, telemetry)

  • Implement link training for IEEE 802.3ck (100G/lane) and 802.3dj (200G/lane), including adaptation algorithms and fallbacks

  • Own FEC interaction (KP4, RS-544) and telemetry pipeline for Predictive Telemetry

  • Lead silicon bring-up, partnering with ASIC design and signal integrity

  • Ensure standards compliance (IEEE 802.3ck/dj, OIF-CEI, CMIS, OSFP)

  • Partition HW-fixed vs. FW-adaptation (equalization, SNR monitoring)

  • Travel: Up to 15% (silicon bring-up, standards meetings)

Skills:

  • Good knowledge of C (C99, MISRA), assembly for critical paths, Python for tools

  • Good knowledge of CI/CD, static analysis, hardware-in-loop tests

  • Good understanding of standards implementation (IEEE 802.3, OIF)

  • Good knowledge of SerDes architecture (equalization, telemetry, interrupts)

  • Self-motivated, with strong sense of ownership and responsibility

  • Good communication and reporting skills

Experience:

  • Principal / Senior Staff (8-10 years post-degree)

  • 8-10 years embedded firmware in high-speed SerDes/retimer products

  • Hands-on PAM4 adaptation (LMS/CMA), FEC (KP4/RS-544)

  • Silicon bring-up as lead (first samples to production)

  • IEEE 802.3ck and 802.3dj link training experience

  • RTOS (FreeRTOS/Zephyr) on constrained MCUs (1MB flash, 256KB RAM)

Education:

  • BS in Electrical Engineering, Computer Engineering, or Computer Science (MS preferred, DSP/comms focus)

If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!

Skills Required

  • 8-10 years of embedded firmware experience in high-speed SerDes or retimer products
  • Hands-on PAM4 adaptation experience, including LMS and CMA algorithms
  • Experience with KP4 and RS-544 FEC
  • Lead experience with silicon bring-up from first samples to production
  • Experience implementing IEEE 802.3ck and IEEE 802.3dj link training
  • Experience with RTOS platforms such as FreeRTOS or Zephyr on constrained MCUs
  • Knowledge of C99 and MISRA C
  • Assembly programming for critical paths
  • Python experience for tooling
  • Knowledge of CI/CD, static analysis, and hardware-in-the-loop testing
  • Understanding of IEEE 802.3 and OIF standards implementation
  • Knowledge of SerDes architecture, equalization, telemetry, and interrupts
  • Bachelor's degree in Electrical Engineering, Computer Engineering, or Computer Science
  • Master's degree with a DSP or communications focus
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The Company
222 Employees

What We Do

Kandou AI is a fabless semiconductor company developing high-speed connectivity for AI infrastructure. Its patented Copper MIMO, also known as Chord Signaling, sends correlated signals at data-processing speeds of 448 Gbps and beyond, providing an alternative to optical interconnects. The company’s technology targets AI data-movement bottlenecks and memory-wall constraints, while its platforms emphasize improved efficiency, lower power and cost, and scalability.

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