Hiring: External Package Innovation Engineer
We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution.
🔹 Role Overview
As an EPI engineer, you will act as both a Role Owner and Key Supporter for OSAT-related development activities, ensuring robust execution from concept through production.
🔹 Key Responsibilities
✅ 1. Role Owner (Strategic & Governance)
- Own and lead OSAT-wide and cross-OSAT initiatives
- Define and deploy standard development templates and success criteria across OSATs
- Drive deployment of Best Known Methods (BKM) and lessons learned
- Develop and maintain technology roadmap and capability assessment for each OSAT site
- Provide Package Innovation (PI) input for:
- External site sourcing strategy
- Site selection process (jointly with interface manager)
- Lead project governance, including:
- Overall project summaries
- Stoplight reporting
- Regular reviews per OSAT site
✅ 2. Supporter (Execution & Project Delivery)
- Support NPI & NTI projects executed at external OSAT factories
- Ensure OSAT compliance with:
- Development processes
- Required documentation/templates
- Drive alignment on SME (Subject Matter Expert) assignment at OSAT
- Support and resolve technical and project issues on-site and across time zones
- Ensure assembly readiness and safe production launch
🔹 Stakeholder Collaboration
You will work closely with cross-functional teams, including:
- Project Leaders & Development Managers
- Designers & Materials Engineers
- Tech Integration & Modelling teams (Electrical, Mechanical, Thermal)
- API and WLP/PLP/FC SMEs
- OSAT partners
🔹 What We’re Looking For
- Strong experience in semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding). Previous exposure to OSAT ecosystem is an added advantage.
- Proven ability to manage cross-site, cross-functional projects
- Solid understanding of NPI/NTI development flows
- Excellent stakeholder management and communication skills
- Ability to drive standardization, governance, and technical problem-solving
🌟 Why Join Us
- Opportunity to lead high-impact package innovation initiatives
- Work with global teams and OSAT partners for wide exposure and fast knowledge & skill growth
- Drive technology roadmap and next-generation packaging solutions
More information about NXP in Malaysia...
#LI-633aSkills Required
- Strong experience in semiconductor packaging with hands-on assembly processes such as pre-assembly and wire bonding
- Exposure to OSAT ecosystem
- Proven ability to manage cross-site, cross-functional projects
- Solid understanding of NPI and NTI development flows
- Excellent stakeholder management and communication skills
- Ability to drive standardization, governance, and technical problem-solving
What We Do
NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer and more sustainable world through innovation. As a world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 34,500 employees in more than 30 countries and posted revenue of $13.21 billion in 2022. Find out more at www.nxp.com. Privacy Policy: https://www.nxp.com/company/about-nxp/privacy-policy-for-social-media-pages:PRIVACY-POLICY-SOCIAL-MEDIA
