onsemi is currently seeking an experienced Process Engineer to support and optimize wafer bumping & DPS manufacturing processes for high-volume semiconductor production. The successful candidate will be responsible for process development, process characterization, yield improvement, defect reduction, equipment qualification, and manufacturing support while ensuring compliance with quality and reliability requirements. Relevant bumping experience may include UBM, photolithography, plating, reflow, wafer thinning, WLCSP, Cu pillar, solder bump, micro-bump, or advanced packaging technologies.
Responsibilities· Own and maintain wafer bumping processes to achieve yield, quality, cycle time, and cost targets.
· Develop, optimize, and sustain bump & DPS related processes including:
- UBM deposition
- Photolithography
- Electroplating
- Reflow
- Wet etch/strip
- Wafer thinning and grinding
- Wafer saw
- Final wafer inspection
· Conduct DOE, process characterization, and robustness studies for new products, materials, equipment, and process changes.
· Perform root cause analysis and implement corrective/preventive actions for yield, reliability, and defectivity issues.
· Lead failure analysis activities related to bump defects such as:
- Missing bump
- Non-wettable bump
- Bridging
- Voids
- Bump height variation
- Oxidation
- Delamination
- Cracking
· Establish SPC monitoring and process control plans.
· Support qualification activities, customer requirements, and manufacturing change management.
· Collaborate with Quality, Reliability, Product Engineering, Equipment Engineering, Suppliers, and Customers on technical issues.
· Evaluate and qualify new materials, bump masks, tooling, and equipment.
· Drive continuous improvement projects to enhance yield, productivity, and cost efficiency.
· Provide technical training and guidance to process technicians and manufacturing personnel.
Qualifications· Bachelor's Degree or higher in:
- Electrical Engineering
- Electronic Engineering
- Materials Science
- Chemical Engineering
- Mechanical Engineering
- Semiconductor Engineering
· Minimum 5 years of semiconductor manufacturing experience.
· Minimum 3 years of direct wafer bumping process experience.
· Strong knowledge of:
- Solder bump technology
- Cu pillar bumping
- WLCSP
- UBM process
- Electroplating
- Reflow process
· Experience in high-volume semiconductor manufacturing environment.
· Strong understanding of SPC, MSA, FMEA, Control Plan, 8D, and DOE methodologies.
· Hands-on experience in process troubleshooting and yield improvement.
· Proficient in statistical data analysis tools such as JMP, Minitab, or equivalent.
· Familiar with semiconductor quality standards and customer qualification requirements.
About UsMore details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
Skills Required
- Bachelor’s degree or higher in Electrical Engineering, Electronic Engineering, Materials Science, Chemical Engineering, Mechanical Engineering, or Semiconductor Engineering
- At least 5 years of semiconductor manufacturing experience
- At least 3 years of direct wafer bumping process experience
- Strong knowledge of solder bump technology, Cu pillar bumping, WLCSP, UBM processing, electroplating, and reflow
- Experience in a high-volume semiconductor manufacturing environment
- Understanding of SPC, MSA, FMEA, Control Plans, 8D, and DOE methodologies
- Hands-on process troubleshooting and yield improvement experience
- Proficiency with JMP, Minitab, or equivalent statistical data analysis tools
- Familiarity with semiconductor quality standards and customer qualification requirements
onsemi Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about onsemi and has not been reviewed or approved by onsemi.
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Retirement Support — Retirement programs are highlighted by a U.S. 401(k) with a 100% match on the first 4% and immediate vesting. International plans such as Ireland’s defined contribution scheme and Germany’s company-funded pension elements reinforce long-term savings.
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Leave & Time Off Breadth — Time-off policies include ten paid holidays, flexible vacation for exempt employees, and three to five weeks of vacation for non-exempt staff as tenure grows, alongside sick time accrual. Paid leaves span parental, bereavement, jury duty, and military service, with Europe locations offering additional statutory and seniority-based days.
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Parental & Family Support — Family supports include eight weeks of paid parental leave, company-sponsored backup care for children, adults, and pets, and up to $15,000 in adoption assistance. Regional provisions such as Switzerland’s child allowance and accessible EAP counseling show added attention to household needs.
onsemi Insights
What We Do
We are building a better future through intelligent technology. For over 60 years, onsemi and its ancestors have been leading the world’s greatest technology advancements. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
