We are seeking a highly motivated engineer to support the METI-SATAS program, focused on development, integration, and deployment of next-generation assembly and test process equipment, factory automation systems, and material handling solutions for a pilot line in Japan. This role spans the full equipment lifecycle-from requirements definition and design through supplier integration, installation, and qualification-in close collaboration with global Intel teams and external equipment and consortia partners. The position is based in Japan and includes hands-on engagement with suppliers and pilot line equipment, process engineering and operations.
The role may focus on process equipment engineering, factory automation and material handling systems, or end-to-end systems integration depending on program needs and candidate experience.
Multiple positions may be filled from this requisition across process equipment engineering, factory automation and material handling systems, and systems integration disciplines.
Key Responsibilities
Define and drive equipment capability requirements across hardware, software, and controls in collaboration with internal teams and suppliers
Own and drive deliverables for assigned scope, ensuring alignment to program goals, schedule commitments, performance targets, and integration requirements
Lead design, development, and integration of assembly/test process equipment and automation systems, including automated material handling (AMHS), EFEMs, load ports, and process tools
Integrate multiple process tools and automation systems into a cohesive pilot line, ensuring synchronized material flow, system performance, and operational efficiency
Partner closely with equipment suppliers (consortia partners) through design, build, installation, and qualification phases
Execute equipment testing and validation, including unit, integration, and pilot line qualification activities
Drive improvements in equipment performance with a focus on reducing energy consumption and consumables/collateral waste, aligned to program productivity and sustainability targets
Contribute to and help drive development and adoption of industry standards (e.g., SEMI) for equipment interoperability
Develop and maintain technical documentation, including installation, operation, and maintenance procedures
Troubleshoot and resolve complex equipment, controls, and integration issues using structured problem-solving and data analysis
Track and communicate project progress, risks, and mitigation plans across stakeholders
Operate effectively in a fast-paced, evolving RnD environment with a high degree of ambiguity
Support development, optimization, qualification, and deployment of assembly/test manufacturing processes and associated equipment.
Drive process capability improvements and manufacturing readiness activities in collaboration with suppliers and pilot-line stakeholders.
Minimum Qualifications
Excellent communication in Japanese and English, and collaboration skills
Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Manufacturing, Systems, or related field)
7+ years of industry experience in process engineering, equipment development, systems integration, semiconductor manufacturing, or manufacturing automation.
5+ years of experience in project management and technical leadership
Strong experience with CAD tools, data analysis, and Microsoft Office applications
Preferred Qualifications
Experience with semiconductor manufacturing process equipment, especially in assembly and test
Experience with semiconductor process development, process characterization, qualification, troubleshooting, and manufacturing optimization.
Familiarity with SEMI standards and equipment interoperability requirements
Experience with semiconductor material handling systems, including FOUPs, trays, EFEMs, load ports, AMHS (stockers, OHV, PGV, AMR), and sorter/handling systems
Experience with industrial controls, factory automation systems, and equipment integration
Experience working in pilot line, RnD factory, or multi-tool integration environments
Familiarity with equipment or process improvements targeting energy efficiency and consumables/material waste reduction
Strong supplier and stakeholder management experience in a global environment
Knowledge and experience with equipment automation, control systems, and software systems is helpful.
Job Type:Intel Contract EmployeeShift:Shift 1 (Japan)Primary Location: Japan, TokyoAdditional Locations:Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Excellent communication in Japanese and English, and collaboration skills
- Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Manufacturing, Systems, or related)
- 7+ years industry experience in process engineering, equipment development, systems integration, semiconductor manufacturing, or manufacturing automation
- 5+ years of experience in project management and technical leadership
- Strong experience with CAD tools, data analysis, and Microsoft Office applications
- Experience with semiconductor manufacturing process equipment, especially in assembly and test
- Experience with semiconductor process development, characterization, qualification, troubleshooting, and manufacturing optimization
- Familiarity with SEMI standards and equipment interoperability requirements
- Experience with material handling systems including FOUPs, trays, EFEMs, load ports, AMHS (stockers, OHV, PGV, AMR), sorter/handling systems
- Experience with industrial controls, factory automation systems, and equipment integration
- Experience working in pilot line, RnD factory, or multi-tool integration environments
- Experience with equipment or process improvements targeting energy efficiency and consumables/material waste reduction
- Strong supplier and stakeholder management experience in a global environment
- Knowledge and experience with equipment automation, control systems, and software systems
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Parental & Family Support — Family-building and caregiving supports are extensive, including fertility coverage, adoption assistance, paid parental leave, childcare and elder care resources, and a structured reintegration for new parents. These benefits are positioned as best-in-class elements of the package.
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Leave & Time Off Breadth — Time off includes generous PTO, a paid sabbatical after extended tenure, and multiple leave types such as family, medical, bereavement, and military. This breadth enables employees to disconnect, recharge, and manage life events.
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Retirement Support — Long-term savings are bolstered by a competitive 401(k) match and access to deferred compensation for eligible levels, alongside stock purchase opportunities. These programs are highlighted as strong tools for financial security.
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