The Role
Lead external manufacturing NPI for semiconductor assembly and packaging, from concept through qualification, production launch, and ramp. Drive wafer-level packaging, bumping, plating, manufacturability, process characterization, risk mitigation, and OSAT readiness. Establish manufacturing strategies, package platforms, best practices, and production baselines while resolving yield and ramp issues. Collaborate across internal and external stakeholders, support audits and continuous improvement, and potentially lead technical team activities.
Summary Generated by Built In
We are looking for a skilled NPI Engineer (Assembly Packaging) to join our External Manufacturing team to drive our growing NPI/ NPD portfolio, especially new tactical engagements critical for onsemi's business growth. In this role, you will leverage your strong expertise and extensive technical network to drive new production introduction, develop new capability requirements, shape manufacturing strategies, and deliver advanced solutions for next-generation silicon technology and packaging solutions.
Responsibilities- Own backend external manufacturing NPI from conceptualization, development, qualification to production launch with a focus on wafer-level packaging (WLP) and post-fab solutions
- Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release
- Drive DFM, technology & manufacturability readiness for new product/ package development, effective POR freeze for new product introduction
- Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include BOM & process setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release
- Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
- Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
- Adoption of data analytics and data-driven approach to problem solving and decision making
- Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production
- Participate in quality and process readiness audit to achieve production site readiness
- Co-work with operations to drive continuous yield improvement for evolving challenges
- Subject Matter Expert to address arising package and assembly challenges
- Experienced candidate(s) will be considered for technical lead role to manage team activities
- Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
- More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience
- Hands-on experience in wafer-level packaging (WLP), bumping and post-fab solutions including electroless & electrolytic plating and other surface finishing technology will be advantageous
- Familiar with plating chemistry/ process and material/ metallurgy characterization & microstructural analysis
- Exposure to power device technologies (SiC, JFET, GaN, IGBT, Hybrid etc)
- Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
- Experience in IC package design/ CAD/ FEA simulation/ characterization will be advantageous
- Good overall understanding of OSAT business landscape and operations
- Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
- Strong project management skills and multi-stakeholder management
- Proficient in statistical analysis methods and familiar with data analytics
- Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
Skills Required
- Bachelor's degree in Engineering, Materials Science, or equivalent technical background
- More than 10 years of experience in backend semiconductor IC manufacturing
- In-depth assembly process expertise and shop floor experience
- Experience with wafer-level packaging, bumping, and post-fab solutions
- Experience with electroless and electrolytic plating and surface finishing technologies
- Familiarity with plating chemistry, process and materials metallurgy, and microstructural analysis
- Exposure to power device technologies including SiC, JFET, GaN, IGBT, or hybrid devices
- Experience in NPI and product or process integration
- Familiarity with Chip-to-Package Interaction effects
- Experience with IC package design, CAD, FEA simulation, or characterization
- Understanding of OSAT business landscape and operations
- Experience with DOE characterization, SPC, failure analysis, and engineering problem solving
- Strong project management and multi-stakeholder management skills
- Proficiency in statistical analysis and data analytics
- Strong written and spoken English communication skills
- Spoken Mandarin proficiency
onsemi Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about onsemi and has not been reviewed or approved by onsemi.
-
Retirement Support — Retirement programs are highlighted by a U.S. 401(k) with a 100% match on the first 4% and immediate vesting. International plans such as Ireland’s defined contribution scheme and Germany’s company-funded pension elements reinforce long-term savings.
-
Leave & Time Off Breadth — Time-off policies include ten paid holidays, flexible vacation for exempt employees, and three to five weeks of vacation for non-exempt staff as tenure grows, alongside sick time accrual. Paid leaves span parental, bereavement, jury duty, and military service, with Europe locations offering additional statutory and seniority-based days.
-
Parental & Family Support — Family supports include eight weeks of paid parental leave, company-sponsored backup care for children, adults, and pets, and up to $15,000 in adoption assistance. Regional provisions such as Switzerland’s child allowance and accessible EAP counseling show added attention to household needs.
onsemi Insights
Am I A Good Fit?
Get Personalized Job Insights.
Our AI-powered fit analysis compares your resume with a job listing so you know if your skills & experience align.
Success! Refresh the page to see how your skills align with this role.
The Company
What We Do
We are building a better future through intelligent technology. For over 60 years, onsemi and its ancestors have been leading the world’s greatest technology advancements. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
