ENGR II, PROCESS; MFG



Job Summary:

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. 

onsemi is hiring a self-directed and self-driven Process Engineer. This is a fast moving and exciting opportunity that will broaden and enhance one skill and challenge the candidate throughout their career. You would be working in the Central Engineering organization (previously named Corporate R&D) and creating next generation of technologies. In addition, you will be supporting the integration of the wafer technologies into the final package and assembly process on a global basis by working with other fabs and our assembly sites and customers around the world. This opportunity is for those who are technically focused and thrive on solving complex challenges as a critical team member in creating the future technology platforms and intellectual property for onsemi.

The successful candidate will have the opportunity to:
·         Support the development and execution of experiments to create new technology platforms
·         Work with the East Fishkill Post FAB team in New York and cross functional teams on global basis to implement processes into manufacturing
·         Enhance technical skills in 300mm wafer thinning, metal deposition, materials, and packaging
·         Understand development strategy and able to convert to (and drive) actionable goals
·         Learn and implement statistical analysis in the development of new processes
·         Assist in driving accountability throughout team to meet metrics
·         Deliver processes and metrics towards meeting project goals and timelines
·         Support and work with the Package Development Teams and customers with process integration, data analytics and reports

Responsibilities Qualifications

Requirements:

 

·         BS degree in Engineering or technical field. MS degree is a plus
·         Experience in semiconductor processing or similar industry
·         Knowledge of wafer thinning, sputter, plating, photolithography, and wafer bonding is a plus
·         Experience working in cross-functional teams to achieve goals and metrics
·         Experience with FMEA risk analysis a plus
·         Intermediate level data analysis skills specifically in Excel or JMP using formulas, pivots, and charts are required
·         Proficiency in Microsoft office, particularly PowerPoint
·         Strong communication skills with experience presenting technical project details
·         Self-motivated and results oriented
·         Fluency (written and oral) in English required

About UsAbout the Team