Be an Early Applicant
Your talent powers our future.
The Role
Drive HBM and WSS bonding process development and yield improvement; support advanced packaging R&D (2.5D/3D/chip stacking); troubleshoot and perform root cause analysis; coordinate global materials and mechanical characterization; design test structures; lead supplier discussions; support on-site project execution and prepare technical reports and presentations.
Summary Generated by Built In
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Specific Responsibilities:
1. Drive HBM process development and yield improvement in WSS process.
2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development
4. Support project on-site execution and make decisions as technical consultant
5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues
6. Generate internal and external documentation for presentations and technical reports
Technology Development
1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs.
2. Project engagement with cross-team interaction, providing expert contribution in materials characterization.
3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site.
4. Provide recommendations for test structure and test vehicle design for material property evaluation.
5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps.
Qualifications:
1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields
2. Must be at least 2 years experience in BONDING related works
3. Solid understanding of WSS/BOND advanced technilogies, 1 or more in below fields:
a) Temporary bonding/debonding (TBDB)
b) Hybrid Bonding (Cu/dielectric)
c) Fusion Bonding / Direct wafer bonding
4. Knowledge of bonding mechanisms - surface activation, adhesion physics, interface energy, thermo-compression and plasma-assisted bonding
5. Hands-on experience with bonding-related tools is a plus, such as SUSS/EVG/TEL, etc
6. Innovative / integration mindset with independent thinking
7. Good team player with a high motivation
8. Fluent communication in both English and Chinese
AI Relevant Job Responsibilities:
- Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
- Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.
- Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact at [email protected] .
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Specific Responsibilities:
1. Drive HBM process development and yield improvement in WSS process.
2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development
4. Support project on-site execution and make decisions as technical consultant
5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues
6. Generate internal and external documentation for presentations and technical reports
Technology Development
1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs.
2. Project engagement with cross-team interaction, providing expert contribution in materials characterization.
3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site.
4. Provide recommendations for test structure and test vehicle design for material property evaluation.
5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps.
Qualifications:
1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields
2. Must be at least 2 years experience in BONDING related works
3. Solid understanding of WSS/BOND advanced technilogies, 1 or more in below fields:
a) Temporary bonding/debonding (TBDB)
b) Hybrid Bonding (Cu/dielectric)
c) Fusion Bonding / Direct wafer bonding
4. Knowledge of bonding mechanisms - surface activation, adhesion physics, interface energy, thermo-compression and plasma-assisted bonding
5. Hands-on experience with bonding-related tools is a plus, such as SUSS/EVG/TEL, etc
6. Innovative / integration mindset with independent thinking
7. Good team player with a high motivation
8. Fluent communication in both English and Chinese
AI Relevant Job Responsibilities:
- Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
- Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.
- Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact at [email protected] .
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Skills Required
- Master's degree or above in Chemistry, Physics, Materials, or Engineering Science related fields (PhD is a plus)
- At least 2 years experience in bonding-related work
- Solid understanding of WSS/BOND advanced technologies; experience in one or more: temporary bonding/debonding (TBDB), hybrid bonding (Cu/dielectric), fusion/direct wafer bonding
- Knowledge of bonding mechanisms: surface activation, adhesion physics, interface energy, thermo-compression and plasma-assisted bonding
- Hands-on experience with bonding-related tools (e.g., SUSS, EVG, TEL)
- Innovative and integration mindset with independent thinking
- Good team player with high motivation
- Fluent communication in both English and Chinese
Micron Technology Compensation & Benefits Highlights
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Retirement Support — A dollar-for-dollar 401(k) match up to 5% of pay, with pre-tax, Roth, and after-tax options, and access to retirement planning tools underpin long-term savings. Recent materials also note student-loan match integration counted toward the same 5% cap.
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Equity Value & Accessibility — An Employee Stock Purchase Plan offers a 15% discount on Micron shares, and eligible roles may receive RSUs at management discretion alongside performance bonuses. Stock and incentive components can materially lift total compensation in stronger business cycles.
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Healthcare Strength — Comprehensive medical, dental, and vision options are paired with onsite or near-site health centers at many U.S. locations, an EAP with free counseling sessions, and employer HSA seed-and-match contributions. 2026 options include Blue Cross and Cigna (plus Kaiser HMO in select sites), and Boise’s onsite clinic lists about a $10 copay for covered members.
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The Company
What We Do
We are a world leader in innovative memory solutions that transform how the world uses information to enrich life for all. For over 45 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.
Why Work With Us
Global opportunities, team member development, and career advancement—Micron invests in you and celebrates your skills, a growth mindset, and the tenacity to strive. At Micron, everyone innovates.
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Micron Technology Offices
Hybrid Workspace
Employees engage in a combination of remote and on-site work.
Micron recognizes the importance of maintaining a healthy work-life balance to foster a culture of collaboration, innovation and meet the needs of the business. In alignment with these values, we offer four flexible work arrangement options
Typical time on-site:
Flexible
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