CPU Subsystem Development

Posted 16 Days Ago
Be an Early Applicant
Tokyo, JPN
In-Office
Entry level
3D Printing
The Role
Lead architecture, specification, RTL design, verification, and product realization of CPU subsystems for next-generation microcontrollers. Responsibilities include optimizing performance, power, and area; developing CPU cores, caches, memory protection, debug, trace, interrupt, and bus components; implementing safety and security features; evaluating new technologies; and coordinating global engineering teams and external partners.
Summary Generated by Built In
Job Description

  • Lead the development of CPU Subsystems (CPUSS), a core component of next-generation microcontrollers.
  • Drive the architecture definition, specification development, design, and verification of CPU subsystem components, including CPU cores, caches, memory protection mechanisms, debug and trace features, interrupt controllers, and bus interfaces.
  • Develop and optimize CPU subsystem solutions for performance, power, and area, while leading RTL design, verification strategies, and the implementation of functional safety and security features. You will also evaluate and introduce new technologies, design methodologies, and architectural innovations for future CPUSS products.
  • Collaborate with global engineering teams and external partners to deliver high-performance, high-quality CPU subsystem solutions from concept through product realization.

Qualifications

<Must Have> 

  • Self-motivated individual with a proactive attitude and a strong willingness to take on new challenges.
  • Experience in logic design and/or functional verification for LSI or IP development.
  • Fundamental knowledge of microcontrollers, SoCs, CPU architectures, and CPU-related peripheral circuits.
  • Experience leading development activities as a project leader, sub-leader, or technical focal point, including coordinating and guiding multiple team members toward successful project execution.

〈Nice to Have〉

  • Solid understanding of CPU architectures, bus protocols, and CPU peripheral circuits.
  • Experience with logic synthesis, non-functional verification (such as CDC, RDC, DFT verification) and timing verification.
  • Broad understanding of semiconductor development beyond logic design, including DFT, physical design, and backend implementation, with the ability to effectively collaborate and communicate with engineers across different design disciplines.
  • Experience managing development projects involving domestic and offshore external partners.
    Knowledge of functional safety and cybersecurity/security technologies.

Additional Information

ルネサスは、「To Make Our Lives Easier(人々の暮らしをより豊かで快適にする)」というPurposeのもと、組込み半導体ソリューションを提供するグローバル企業です。世界30か国以上で活躍する21,000人を超えるエンジニアや課題解決のプロフェッショナルとともに、自動車、産業、インフラ、IoT分野における世界最先端のテクノロジー開発に携わり、より安全で、健康的で、環境にやさしく、スマートな未来の実現に貢献しています。 

 

ルネサスでは、「TAGIE(Transparent、Agile、Global、Innovative、Entrepreneurial)」を企業文化の中核としています。TAGIEは、私たちの働き方や成長のあり方、そしてPurposeの実現に向けた取り組みを支える共通の価値観です。この協調的な精神と挑戦するマインドセットが、半導体技術を通じた産業の変革と、世界中の人々の暮らしへの貢献を可能にしています。 

 

私たちは、競争力のある報酬制度に加え、充実した福利厚生をご用意しています。福利厚生の詳細については、選考プロセスの中でご案内いたします。 

 

私たちとともに未来を創造する挑戦に、ぜひ参加しませんか。皆さまからのご応募をお待ちしております。 

Skills Required

  • Experience in logic design or functional verification for LSI or IP development
  • Fundamental knowledge of microcontrollers, SoCs, CPU architectures, and CPU peripheral circuits
  • Experience leading development activities as a project leader, sub-leader, or technical focal point
  • Ability to coordinate and guide multiple team members toward successful project execution
  • Self-motivated, proactive attitude and willingness to take on new challenges
  • Understanding of CPU architectures, bus protocols, and CPU peripheral circuits
  • Experience with logic synthesis, CDC, RDC, DFT verification, and timing verification
  • Understanding of DFT, physical design, and backend implementation
  • Experience managing projects involving domestic and offshore external partners
  • Knowledge of functional safety and cybersecurity technologies

Renesas Electronics Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Renesas Electronics and has not been reviewed or approved by Renesas Electronics.

  • Fair & Transparent Compensation — Feedback suggests pay is generally fair-to-good across many roles, with base pay aligned to prevailing market levels in multiple U.S. locations. Engineering and leadership tracks can be competitive on total compensation, reinforcing a sense that pay can meet market expectations in key job families.
  • Healthcare Strength — Feedback suggests core medical, dental, and vision coverage is solid and well-regarded by employees. Day-one eligibility in U.S. roles is described, supporting confidence in access and continuity of care.
  • Leave & Time Off Breadth — Feedback suggests PTO, paid holidays, sick time, and parental leave provide a comprehensive time-off framework. Company initiatives like Renesas Day and meeting-light Focus Fridays further support time away and balance.

Renesas Electronics Insights

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The Company
HQ: Tokyo
10,040 Employees

What We Do

We're the world's leading semiconductor manufacturer. Our mission is to make our lives easier and a world that's safer, healthier, greener, and smarter.

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