Chip Lead

Key Responsibilities

• Support micro-architecture development working with marketing and architecture teams
• Collaborate with system architects to define chip functionality, interfaces, and performance targets
• Collaborate with cross-functional design teams (digital design, verification, DFT, analog and packaging) to define chip and block partitions
• Responsible for chip level micro-architecture specifications
• Responsible for 3rd party IP evaluation and arrive at a plan of record for execution vis-à-vis power, area, performance and schedule
• Work closely with physical design team for physical implementation
• Oversee all aspects of the chip execution through tape-out and bring-up
• Define production and bench-level test plans
• Stay up to date with industry trends, emerging technologies and progress in standards’ bodies

Qualifications

• Bachelors or Masters or Ph.D in Electrical Engineering and related fields, or equivalent
• 12+ years of experience in high-speed digital design (preferably in retimer, gearbox, Ethernet PMA/PCS logic)
• Strong understanding of digital and analog design principles, expertise in RTL based digital IC design using SystemVerilog
• Proficiency in synthesis and implementation tools (Synopsys or Cadence)
• Experience with 3rd party high-speed interface IPs and low-speed IO interface Ips
• Excellent problem-solving skills and attention to details
• A self-starter with the ability to assume technical leadership in exploring new design paradigms
• Knowledge of Ethernet 802.3 standards’ clauses related to 100G/200G/400G/800G, Auto-Negotiation and Link Training
• Strong bias for innovations across all aspects of digital design including automation of mundane activities and methods for quality improvement
• Expertise in Forward Error Correction (FEC) code implementation and performance analysis
• Proven track record of being part of a start-up like environment
• Knowledge of DRAM Controllers/PHYs and HBM Memory a plus