- The Mold Process Chief Engineer is a senior technical leader responsible for driving world-class manufacturing performance through advanced Mold process, tooling, and equipment optimization. This role leads strategic initiatives focused on yield improvement, quality excellence, cost reduction, productivity enhancement, and process robustness. The ideal candidate possesses deep expertise in Mold equipment, mold tooling design and qualification, process development, and semiconductor assembly manufacturing, while collaborating across global teams to achieve business objectives and customer satisfaction.
- Lead and drive Mold process, tooling, and equipment improvement initiatives to enhance yield, quality, productivity, cost performance, and process capability.
- Serve as the technical expert for Mold tooling design, qualification, optimization, maintenance strategy, and troubleshooting across manufacturing operations.
- Develop, optimize, and implement robust Mold processes using statistical and engineering methodologies including SPC, DOE, FMEA, MSA, and structured problem-solving techniques.
- Drive process characterization, equipment evaluations, tooling qualifications, and technology transfers for new products and process enhancements.
- Lead investigations and corrective actions for customer complaints, production excursions, OQA findings, and Mold-related quality issues.
- Own Mold yield performance by identifying and eliminating defect mechanisms through data-driven analysis and continuous process optimization.
- Define equipment specifications and collaborate with suppliers on Mold equipment and tooling improvements, upgrades, and technology roadmaps.
- Develop and maintain process documentation including FMEA, Control Plans, Work Instructions, Best Known Methods (BKM), and standardized manufacturing practices.
- Partner with global engineering, operations, quality, maintenance, and supply chain teams to drive process standardization and operational excellence.
- Mentor and develop Mold Process Engineers through technical coaching, training, and best-practice sharing.
- Bachelor's Degree in Engineering with 8+ years of semiconductor assembly manufacturing experience, with extensive exposure in Mold Process Engineering, both auto-molding and manual molding.
- Strong expertise in Transfer Molding processes, Mold equipment platforms, mold tooling design, tooling qualification, tooling maintenance strategies, and Epoxy Molding Compound (EMC) materials.
- Hands-on experience with leading Mold equipment suppliers and platforms, including equipment setup, optimization, troubleshooting, and process characterization.
- Demonstrated experience in tooling development, cavity balancing, mold chase optimization, runner/gate design evaluation, and defect reduction initiatives.
- Proficiency in statistical and engineering tools such as Minitab, JMP, SPC, DOE, FMEA, MSA, DFM, Six Sigma, and Root Cause Analysis methodologies.
- Extensive knowledge in problem solving methodology i.e. 8D report, DMAIC, Phenomena Mechanism approach and the like.
- Proven track record in delivering yield improvement, cost reduction, process optimization, and manufacturing excellence programs.
- Strong analytical and troubleshooting capabilities with the ability to resolve complex process, equipment, and tooling-related challenges.
- Excellent project management, leadership, and stakeholder management skills within a cross-functional and global environment.
- Strong communication and presentation skills, with the ability to influence technical and business decisions.
- Proficiency in Microsoft Office applications including data analytics (i.e. Spot fire).
Why work for us:
- Competitive salary and benefits package.
- Opportunities for professional development and growth.
- A commitment to workplace safety and employee well-being.
- An innovative and dynamic work environment
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
D&I Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.
Skills Required
- Bachelor's Degree in Engineering with at least 8 years of experience in Semiconductor Assembly Engineering, preferably in Mold Process Engineering.
- Strong technical knowledge of Mold processes, Mold equipment, tooling, process controls, and Epoxy Molding Compound (EMC) materials.
- Proficiency in statistical analysis and engineering tools such as Minitab, JMP, SPC, DOE, FMEA, DFM, and structured problem-solving techniques.
- Experience driving process optimization, yield improvement, cost reduction, and continuous improvement projects in a manufacturing environment.
- Strong analytical, troubleshooting, and project management skills with the ability to manage multiple priorities.
- Excellent communication and collaboration skills, with experience working effectively across cross-functional teams.
- Proficiency in Microsoft Office applications and a customer-focused mindset with strong leadership potential.
What We Do
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications. The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power and performance. Nexperia's commitment to innovation, efficiency, sustainability, and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards. For questions or more information about our career opportunities: [email protected] Connect with us today and become a part of TeamNexperia! Nexperia - Efficiency Wins.
