Intel is seeking an experienced APTM NPI (New Product Introduction) Integrator to lead technology transfer, manufacturing readiness, quality improvement, and yield optimization activities for advanced packaging and technology development programs. The successful candidate will drive the integration of new technologies into manufacturing by defining roadmaps, establishing operational strategies, and ensuring product and process readiness from startup through high-volume manufacturing.
This role requires combines deep manufacturing expertise, advanced data analytics capabilities, and strategic influence to accelerate technology deployment, improve manufacturing performance, and drive organizational excellence.
We are seeking a highly motivated and technically skilled Integrator to lead the development and execution of new product/ process introduction and process transfers across factories.
The ideal candidate will play a key role in ensuring that technology, platforms, and products meet certification requirements before transferring to HVM.
The NPI integrator will be responsible for but not limited to:
- Being the logistical coordinator of introducing a new product into the factory by supplying the required process documentation to factory customers.
- Primary information interface between the fab and the upstream/downstream customers.
- Tracking the collateral items, communicating wafer shipping to post fab customers, creating and updating the product codes in the internal systems.
- Setting up lot flows, kicking off NPI Checklists for each module, starting the silicon and monitoring its progress through the process flow for set up, power-on and engineering samples until first production.
- Develop and implement new NPI systems and business processes as they become ready and close any issues identified in a NPI reflection
- Utilize data analytics tools (e.g., SQL, Python) to synthesize insights from structured and unstructured data, driving continuous process improvement and troubleshooting.
- Lead cross-functional teams through model-based problem-solving methodologies to address process excursions and drive operational efficiencies.
The candidate should exhibit the following behavioral traits:
- Candidates are expected to have strong understanding of a product’s life cycle, fab processing, and post fab activities.
- Good understanding of key product/ process development milestones.
- Should possess strong experience working with and managing NPI builds in factory environment. Able to drive capacity execution efficiency accordingly.
- Demonstrated ability to learn quickly and apply new concepts to solve complex problems.
This role requires regular onsite presence to fulfill essential job responsibilities.
Qualifications:Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience.
Minimum Qualifications
- Bachelor's degree in Chemistry, Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field, plus 2+ years of relevant experience; OR
- Master's degree in one of the fields listed above, plus 1+ year of relevant experience.
The experience listed above should include a combination of the following:
- Engineering fundamentals and manufacturing workflows.
- Data extraction and analysis using tools such as SQL and/or Python.
This position is not eligible for intel immigration sponsorship.
Preferred Qualifications
- Experience in more than one process module in a WLA, Die Prep, Sort, or Fab environment.
- Familiarity with manufacturing systems such as MES300 and process flow route creation.
- Knowledge of process improvement methodologies, including Intel's Change Control Process and Model-Based Problem Solving (MBPS).
- Experience with new product introduction (NPI) project management and startup of new technologies.
- Process Integration: Experience in integrating packaging processes with overall product manufacturing workflows.
- Package Design: Experience in designing packaging solutions that meet product specifications, regulatory requirements, and customer needs.
- Previous related work experience in a semiconductor foundry.
Join Intel to be part of a team that drives innovation, shapes the future of manufacturing, and delivers impactful solutions to global technology challenges.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $89,010.00-146,440.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree in Chemistry, Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field, plus 2 or more years of relevant experience
- Master's degree in Chemistry, Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field, plus 1 or more year of relevant experience
- Experience with engineering fundamentals and manufacturing workflows
- Experience extracting and analyzing data using SQL and/or Python
- Experience in more than one process module in a WLA, Die Prep, Sort, or Fab environment
- Familiarity with MES300 and process flow route creation
- Knowledge of process improvement methodologies, Intel's Change Control Process, and Model-Based Problem Solving
- Experience with new product introduction project management and startup of new technologies
- Process integration experience involving packaging processes and overall product manufacturing workflows
- Package design experience meeting product specifications, regulatory requirements, and customer needs
- Previous related work experience in a semiconductor foundry
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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