APTD Equipment Engineer

Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Equipment Development Engineer - Advanced Packaging Technology Development
As an Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will be primarily responsible for developing and optimizing next generation, first of a kind (FAOK) wafer and die equipment (Post probe wafer and die development) to improve capability, productivity and cost of such equipment. You will take ideas from conception, through equipment and sub-component development, all the way to implementation in APTD and manufacturing facilities. You will also be required to identify, diagnose, and resolve equipment related problems by applying failure analysis, FMEA, 8D or FDC/Data Science methodology. Additional responsibilities include coordinating and carrying out equipment evaluation/optimization to implement changes, leading and participating in equipment maturity and availability improvement and cost reduction activities.
You will be working in a highly collaborative atmosphere, interacting with various groups such as process development, manufacturing, and equipment vendors, to ensure robust processes that meet the detailed physical requirements for Micron products. You will grow into an expert engineer, driving post probe wafer and assembly technology roadmaps, which have a direct influence on Micron's global leadership in semiconductor manufacturing.
Responsibilities include, but not limited to:

• 3+ or more years of semiconductor process or equipment engineering experience, package stacking equipment TC bonder/ Hybrid Bonder. (equipment ex: BESI, ASMPT...)
• Develop hardware roadmaps for 5+ years in the area of post probe wafer and die processing.
• Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron's products. cost, availability, and improve hardware and process capability.
• Optimizing equipment to reduce
• Collaborating with process development teams to develop innovative new solutions.
• Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive APTD development projects with OEMs vendors for solutions.
• Performing fundamental research to drive innovative solutions for next-generation equipment products.
• Support equipment transfer to production facilities (some domestic or international travel may be required).

Minimum Qualifications:

• Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis
• Strong analytical and creative problem-solving skills.
• Ability to use extensive technical knowledge to guide strategic directions.
• Ability to resolve complex issues through root-cause or model-based problem solving.
• FOAK main Accountable to co-work with responsible (Micron team/Vendor)
• Proficiency in statistics, preferably in statistical process control.
• Ability to work independently, with minimal direction, and a focus on meeting commitments.
• Ability to multi-task and manage numerous projects simultaneously.
• Hands on experience with wafer / assembly tools and overlay systems.

Education and Experience.

• M.S./Ph. D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields.
• 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field
• Experience in equipment development with fundamental understanding of post probe and assembly process and equipment interactions.
• Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related inline/electrical/probe failure.
• Knowledge of semiconductor processing, solid-state device physics desirable.

About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact at [email protected] .
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