The Group: Intel's Advanced Design Foundational IP Organization (AD-FIP) within Design Technology Platform (DTP) focuses on pathfinding and development of advanced logic, memory, and analog/mixed-signal circuits to enable best-in-class Foundational IP collateral and product design across all generations of Intel process technology. Critical technologies AD-FIP delivers to Intel are Digital and Analog Standard Cell Libraries, Embedded Memory (SRAM, RF, ROM, eDRAM, Fuse, etc.), Analog Circuit Reference Designs (PLL, BGR, ADC, etc.), High-speed I/O Reference Designs (DDR, UCIe, PCIe, SerDes, GPIO), RF and Wireless Circuits (Wave Guide TX, Power Amplifier).
As an analog and mixed-signal IC designer your day-to-day responsibilities will include, but not always be limited to:
- Developing, designing and testing circuit blocks including wireline IO AFEs, clocking circuits, and voltage regulator circuits as well as integrating them into Intel's leading technology test chips.
- Capture of design and measurement results to guide the next generation of process technology and circuit specifications based on requirements for SoC building blocks and critical wireline interfaces.
- Work closely with process and IP engineers to anticipate AMS IP requirements and use design and test results to inform and accelerate process technology and product development.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
- Bachelor’s degree in Electrical, Computer or Electrical and Computer Engineering, or related STEM field with 10+ years of experience, OR
- Master's degree in Electrical, Computer or Electrical and Computer Engineering, or related STEM field with 8+ years of experience, OR
- Ph.D. in Electrical, Computer or Electrical and Computer Engineering, or related STEM field with 3+ years of experience.
The qualifications listed below must meet the required years of experience associated with the candidate’s degree level:
- Experience with design of custom analog or mixed-signal circuits.
- Analog or mixed signal design skills including specification, design or verification.
Preferred Qualifications:
Experience in one or more of the following areas is preferred:
- GPIOs, high speed parallel or serial IO links and their subcomponents (data path, TX, RX, etc.), clock distribution, clock conditioning, clock recovery circuits, voltage regulators, voltage reference circuits, ADCs/DACs, inductors, transmission lines, RF and millimeter-wave circuits, test of custom analog and mixed-signal circuits.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:US, California, Santa ClaraBusiness group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $164,470.00-269,100.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree in Electrical, Computer or Electrical and Computer Engineering, or related STEM field
- 10+ years of experience, or 8+ years with Master's degree, or 3+ years with Ph.D.
- Experience with design of custom analog or mixed-signal circuits
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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