We are seeking a highly motivated and experienced Sr R&D Scientist to join our APAC R&D Team. In this role, you will be instrumental in driving the development of novel materials from concept to commercialization. You will lead projects focused on semiconductor back-end and packaging materials, from board-level to chip-level. The ideal candidate will combine deep technical expertise with a passion for creating new products, forging strategic external partnerships, and mentoring junior engineers. If you are an open-minded problem-solver who enjoys challenges and has a proven track record of successful product translation, we encourage you to apply.
Responsibilities
Key Responsibilities
· Lead the development of innovative products for TIM and Packaging Materials for electronic customers.
· Generate innovative ideas, design material formulations, and develop robust processes to realize product concepts.
· Design experiments, analyze data, and troubleshoot complex material-related issues, including understanding failure modes in electronic packaging applications.
· Closely working with cross function team (technology, sales, marketing, AE) to develop end-to-end solution, ensure successful market launch.
· Proactively identify, evaluate, and establish strategic partnerships with external entities such as universities, research institutes, and startups, evaluate the technical capabilities and maturity.
· Work independently to manage multiple projects, ensuring they meet technical, timeline, and budgetary goals.
· Provide technical leadership within the R&D team, offering guidance and mentorship to junior engineers.
Qualifications
Required Qualifications
· Advanced degree (Master’s required, Ph.D. strongly preferred) in Materials Science, Chemistry, Polymer Science, Chemical Engineering, or a closely related field.
· Minimum 5 years of hands-on industrial R&D experience in electronic materials, specifically within electronic packaging.
· In-depth understanding and knowledge in polymer structure property relationships, polymer filler interaction, adhesion and interface phenomena, rheological property control, polymer and intermediates modification.
· Comprehensive knowledge in adhesive technology or heat management or packaging for electronic devices.
· Proven experience in product development and a successful track record of technology transfer and product commercialization.
· Strong communication skills, English can be used as a working language.
· Ability to work autonomously, lead technical projects, and provide effective guidance to less experienced team members.
· Proactive, result-oriented, and comfortable in a dynamic, fast-paced environment.
· Be willing to travel as needed for customer support, partner meetings, etc.
About UsAbout Solstice Advanced Materials
Solstice Advanced Materials is a leading global specialty materials company that advances science for smarter outcomes. Solstice offers high-performance solutions that enable critical industries and applications, including refrigerants, semiconductor manufacturing, data center cooling, nuclear power, protective fibers, healthcare packaging and more. Solstice is recognized for developing next-generation materials through some of the industry's most renowned brands such as Solstice®, Genetron®, Aclar®, Spectra®, Fluka™, and Hydranal™. Partnering with over 3,000 customers across more than 120 countries and territories and supported by a robust portfolio of over 5,700 patents, Solstice’s approximately 4,000 employees worldwide drive innovation in materials science. For more information, visit Advanced Materials.
About the Team
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Skills Required
- Master's degree in Materials Science, Chemistry, Polymer Science, Chemical Engineering, or closely related field
- Ph.D. in Materials Science, Chemistry, Polymer Science, Chemical Engineering, or related field
- Minimum 5 years of hands-on industrial R&D experience in electronic materials, specifically electronic packaging
- In-depth knowledge of polymer structure-property relationships, polymer filler interaction, adhesion/interface phenomena, rheological control, and polymer/intermediates modification
- Comprehensive knowledge in adhesive technology, heat management, or packaging for electronic devices
- Proven product development experience including technology transfer and product commercialization
- Strong communication skills with English as a working language
- Ability to work autonomously, lead technical projects, and mentor junior team members
- Willingness to travel as needed for customer support and partner meetings
What We Do
Solstice, part of Kin + Carta, is a modern software engineering firm that helps Fortune 500 companies seize new opportunities through world-changing digital solutions. As strategists and consultants, we help organizations evolve their digital strategy to solve mission-critical problems. As designers and developers, we build incredible hardware and software solutions that transcend a standalone product and transform an organization’s relationship with its customers. As instructors and coaches, we help companies transform from the inside out by adopting a high-speed culture of innovation. We’re strategists, researchers, designers, and engineers hell-bent on changing the way the world does business. We’re headquartered in Chicago and have delivery offices in New York, London, and Buenos Aires. For more information about Solstice, visit solstice.com
