Advance Packaging Process Development Engineer

Posted 3 Hours Ago
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Taichung City, TWN
In-Office
Entry level
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Your talent powers our future.
The Role
Develop, configure, and optimize semiconductor package assembly and wafer‑level processes (bumping, TSV, bonding, CMP). Support product ramp, run tests, approve materials/equipment changes, create process guidelines, and collaborate with global design and manufacturing teams.
Summary Generated by Built In
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
JOB DESCRIPTION:
Micron's Assembly Package Process Development team is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end, bonding and back end) for Micron's memory products ramp up including side by side certification with Manufacturing teams. Assessing processes by knowledge and skills, taking measurements and interpreting data are everyday responsibilities and expectations for the successful candidate. Other deliverables in this job function are Assembly process guideline rules working closely with Design teams (Globally) and you will be involved in the running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board). An importance of this role is process capability of innovative package technology: Deep fundamental understanding of the key risks in Bumping, TSV (Through-Silicon Via) packaging technologies. Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), and Ball Mount is a plus. Finally, hands on integration experience in Package Assembly and Wafer Level package process are needed.
JOB REQUIREMENT
  • 0-2 years of experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes. Experience with High Bandwidth Memory (HBM) integration is a plus.
  • Education: Bachelor degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics or related field. PhD / Masters Degree is preferred
  • Technical Experience: Development experience in one or more areas of Photo, Physical Vapor Deposition (PVD),Chemical Vapor Deposition (CVD), Chemical Mechanical Planarization (CMP), wafer level molding, wafer level ball mount, Thermo-Compression Bonding (TCB), Flip Chip (FC), Underfill (UF), Hybrid bond, Glass carrier bond/ de-bond is a plus
  • Problem-Solving Abilities: Strong analytical and problem-solving skills, with the ability to troubleshoot issues and optimize process parameters.
  • Communication Skills: Effective verbal and written communication skills, with the ability to communicate clearly and professionally with team members and stakeholders
  • Adaptability: Ability to work effectively in a fast-paced and dynamic environment, with the flexibility to work with global teams across different time zones
  • Team Player: Collaborative mindset with a willingness to work closely with cross-functional teams to achieve common goals.

Inclusion & Accessibility Statement
Micron is committed to fair, inclusive, and merit-based hiring. Reasonable accommodation is available to enable individuals with disabilities to perform the essential functions of this role. All qualified candidates are encouraged to apply.
Values Alignment
Successful candidates are expected to embody Micron's core values:
  • People - Respect, develop, and empower others
  • Innovation - Drive continuous improvement and breakthrough thinking
  • Tenacity - Demonstrate accountability and perseverance
  • Collaboration - Build trust and work as one team
  • Customer Focus - Deliver excellence and value

AI Relevant Job Responsibilities:
- Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
- Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.
- Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact at [email protected] .
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Skills Required

  • 0-2 years of experience in semiconductor manufacturing or related field
  • Hands-on experience in semiconductor packaging or frontend processes
  • Bachelor's degree in Electrical, Mechanical, Materials Science, Chemical Engineering, Physics or related field
  • Hands-on integration experience in Package Assembly and Wafer Level package process
  • Masters or PhD degree
  • Experience with High Bandwidth Memory (HBM) integration
  • Experience with TCB, CMP, Ball Mount (listed as plus)
  • Development experience with Photo, PVD, CVD, CMP, wafer level molding, wafer level ball mount, TCB, Flip Chip, Underfill, Hybrid bond, Glass carrier bond/de-bond
  • Strong analytical and problem-solving skills
  • Effective verbal and written communication skills
  • Ability to work effectively in fast-paced, dynamic, global team environments
  • Collaborative mindset and willingness to work cross-functionally

Micron Technology Compensation & Benefits Highlights

  • Retirement Support The RAM 401(k) plan provides a dollar‑for‑dollar company match up to 5% of eligible pay with automatic enrollment and escalation. After‑tax contributions and in‑plan Roth conversions add flexibility for additional savings.
  • Healthcare Strength Multiple medical plan options with HSA/FSA support, mental‑health resources, and wellness programs are documented. Access to the Micron Family Health Center at Boise for enrollees adds onsite care in certain locations.
  • Equity Value & Accessibility An Employee Stock Purchase Plan enables purchases of company stock at a 15% discount in multiple regions. Company materials also reference equity participation, reinforcing employee ownership opportunities.

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The Company
HQ: Boise, ID
45,000 Employees
Year Founded: 1978

What We Do

We are a world leader in innovative memory solutions that transform how the world uses information to enrich life for all. For over 45 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

Why Work With Us

Global opportunities, team member development, and career advancement—Micron invests in you and celebrates your skills, a growth mindset, and the tenacity to strive. At Micron, everyone innovates.

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Micron Technology Offices

Hybrid Workspace

Employees engage in a combination of remote and on-site work.

Micron recognizes the importance of maintaining a healthy work-life balance to foster a culture of collaboration, innovation and meet the needs of the business. In alignment with these values, we offer four flexible work arrangement options

Typical time on-site: Flexible
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