Your role at C12 Quantum Electronics:
- You will develop 2.5D and 3D integration architectures for quantum processors and supporting electronics.
- You will design interposers, through-silicon vias, micro-bumps, hybrid bonds, redistribution layers, and chiplet interfaces.
- You will integrate our QPU with other chip modality with cryogenic CMOS, RF/microwave circuitry, photonics, MEMS, and packaging substrates.
- You will perform electrical, electromagnetic, mechanical, and thermal simulations.
- You will define fabrication flows and design rules with foundries, packaging partners, and internal process teams.
- You will develop test vehicles and perform experimental measurements on those fabricated devices, analyze experimental data to improve yield and performance.
- You will document designs, process specifications, qualification results, and technology roadmaps.
- You will collaborate with quantum-device, circuit-design, cryogenic, materials, manufacturing, and systems teams.
We are seeking a 3D Integration Engineer to develop advanced packaging and heterogeneous-integration technologies for scalable quantum-computing hardware.
You will design and optimize interconnects between quantum devices, control electronics, photonic components, and cryogenic systems while maintaining signal integrity, thermal performance and reliability.
About you:
- You have a Bachelor’s or Master’s degree in electrical engineering, materials science, mechanical engineering, applied physics, or a related discipline.
- You have experience in semiconductor packaging, wafer-level integration, MEMS, microfabrication, or heterogeneous integration.
- You are familiar with one or more relevant processes: wafer bonding, hybrid bonding, TSVs, flip-chip assembly, thin-film deposition, lithography, etching, electroplating, or CMP.
- You are familiar with package-level electrical, thermal, and mechanical design.
- You have experience with CAD, electromagnetic simulation tools, multiphysics simulation, statistical analysis, or semiconductor process-development tools.
- You have strong experimental, troubleshooting, documentation, and cross-functional communication skills.
- PhD or equivalent industry experience in advanced packaging or semiconductor integration.
- Experience with superconducting, semiconductor-spin, trapped-ion, neutral-atom, or photonic quantum-computing platforms.
- Experience with RF/microwave interconnects, photonic coupling, or high-density chiplet systems.
- Experience transferring a packaging or integration process from research into pilot or volume manufacturing.
What we offer:
- 60,000 euros - 78,000 euros yearly base salary
- Stock options for every employee (BSPCE/ESOP)
- Sponsored trip to conferences around the world
- A highly dynamic international team
- Swile meal vouchers
- Mental health support with moka.care
- Training budget/ Annual Learning & Development Allowance
- Sabbatical leave (after 2 years in the company)
- Vibrant office culture (two office spaces in the heart of Paris, team lunches, offsite events, Friday breakfasts..)
You should join us if...
- You want to have a key role in a growing startup with challenges at the frontier of the technology.
- You want to contribute to achieving landmark results in quantum computing, making a difference in the emerging quantum technologies.
- You want to work within a 60-people team with various backgrounds in nanofabrication, quantum electronics, and carbon nanotube science to create a revolutionary quantum computing processor.
- You want to thrive in an exceptional scientific environment with several industrial and academic partners.
- You share our values (excellence, scientific integrity, diversity, curiosity, and care) and want to help us define our product-focused culture and ambition to accelerate.
Skills Required
- Bachelor's or Master's degree in electrical engineering, materials science, mechanical engineering, applied physics, or a related discipline
- Experience in semiconductor packaging, wafer-level integration, MEMS, microfabrication, or heterogeneous integration
- Familiarity with wafer bonding, hybrid bonding, TSVs, flip-chip assembly, thin-film deposition, lithography, etching, electroplating, or CMP
- Familiarity with package-level electrical, thermal, and mechanical design
- Experience with CAD, electromagnetic simulation tools, multiphysics simulation, statistical analysis, or semiconductor process-development tools
- Strong experimental and troubleshooting skills
- Strong documentation and cross-functional communication skills
- PhD or equivalent industry experience in advanced packaging or semiconductor integration
- Experience with superconducting, semiconductor-spin, trapped-ion, neutral-atom, or photonic quantum-computing platforms
- Experience with RF/microwave interconnects, photonic coupling, or high-density chiplet systems
- Experience transferring a packaging or integration process from research into pilot or volume manufacturing
What We Do
C12 is building reliable quantum computers. The company is a spin-off from ENS launched in January 2020 by twin brothers Matthieu and Pierre Desjardins to supercharge the development of the lab’s promising new quantum technology. Quantum computing has the potential to change our lives. But frequent errors limit the technology’s viability. We are tackling the fundamental issue: the nature of the hardware itself. We are tapping into the simplest material–carbon–to drive a technological breakthrough in the field. Unlike other quantum computers, we use carbon nanotubes as the fundamental building block of our processor. By combining the power of an ultra-pure material with an easy-to-manufacture semiconductor device, we are building a scalable platform for quantum computing. Our executive co-founders bring a unique combination of scientific excellence and business skills to the company. Our team is made up of the world’s most accomplished experts in quantum electronics and carbon nanotube science. Our scientific advisors are renowned scientists and pioneers in spin qubits: Dr. Takis Kontos, Dr. Matthieu Delbecq and Dr. Jérémie Viennot. In June 2021, C12 secured a $10 million seed round with funding from 360 Capital, Bpifrance (Digital Venture Fund), Airbus Ventures, BNP Paribas Développement, and Octave Klaba (OVHcloud), and additional grants from Bpifrance and the Ile-de-France Region. We are leading quantum’s next material breakthrough, and we are just getting started. Silicon enabled the emergence of classical computing – it’s time for carbon to do the same for quantum !
