Jobs at Skorpios Technologies

Lead technical strategy and execution for III-V and silicon photonics product development. Oversee simulation, design-for-manufacturability, process development, device characterization, and transition from R&D to high-volume manufacturing while partnering with executive leadership and customers.

Support development and sustainment of metrology for wafer fabrication: partner with engineering teams, analyze metrology data, maintain recipes and operating specs, troubleshoot tools, apply SPC, and train technicians in a cleanroom production environment.

Develop and execute integration plans for semiconductor and silicon photonics devices, correlate device outputs to factory metrics, analyze metrology, propose data-driven process improvements, and drive cross-functional teams to implement high-yield, production-ready processes in a cleanroom/manufacturing environment.

Lead RF design, modeling, simulation, layout and testing for Si-photonic and co-packaged HPIC products. Responsibilities include transmission line and impedance modeling to 120 GHz, device parasitic analysis, netlist/DRC and PCB/HPIC layout, RF/electro-optical s-parameter measurement, DOE and DFM, design reviews, and manufacturing handoff.

Lead design, simulation, and electro-optical characterization of high-speed InP Mach-Zehnder modulators and photodiodes. Drive device modeling, collaborate with layout and process engineers, validate prototypes against models, and support transition to high-volume manufacturing in a fast-paced startup.

Design, simulate, and optimize high-performance silicon photonics devices (couplers, WDM, polarization components, hybrids). Define fabrication-tolerant layouts, run DOE and validation testing, collaborate with layout and process engineers, characterize devices, analyze data, and produce performance reports to enable manufacturable Si photonics system chips.

Lead high-fidelity modeling and simulation of photonic integrated circuits (lasers, modulators, photodiodes, couplers). Couple optical, electrical, and thermal solvers, optimize RF performance, collaborate with in-house fab for layouts, run virtual DOE, and validate models against lab data.

Develop, sustain, and optimize diffusion processes for wafer fabrication. Partner with integration, product, and equipment teams to run experiments, analyze metrology/SPC data, troubleshoot deviations, document processes, train technicians, and improve yield, cycle time, and tool availability while supporting shift-based manufacturing operations.

Executive leader responsible for strategy and operations of the semiconductor fabrication facility. Oversees process, integration, equipment, and yield engineering to scale HVM, manage CapEx/OpEx, drive technology transfers, ensure quality and continuity, lead vendor relations, and build a high-performance engineering organization.

Design, model, and simulate III-V lasers, modulators (EAM, MZM), and photodetectors for silicon photonics integration. Perform RF and optical simulations, impedance matching, layout support, DOE and validation testing, characterization, data analysis, and DFM for manufacturable designs.

Lead unit process engineering teams (Litho, Etch, Thin Films, CMP) to ensure tool capability, process stability, SPC-driven yield, and scalable high-volume manufacturing. Drive DOE/FMEA, equipment optimization, NPI/technology transfer, vendor and CapEx management, continuous improvement, and provide 24/7 technical escalation and executive reporting for Fab operations.

Lead mechanical design and assembly of high-precision, size- and weight-constrained components, fixtures, and test stations for optical networking products. Create detailed 3D SolidWorks drawings, recommend materials, prototype parts, perform mechanical assembly and prove-in, and collaborate with local and overseas machine shops. Work involves sub-micron optical alignment, fiber optics, epoxies, and precision temperature-controlled testing.

Design and verify PCB and PCBA circuits for silicon photonics optical modules (transceivers, LiDAR, sensors). Lead schematic capture, circuit simulation, PCB layout, prototype testing, DVT, BOM ownership, cross-functional design reviews, and customer technical support throughout product development.