Jobs at Pragmatic

Leads semiconductor process integration for 300mm wafer fabs, including new technology introduction, yield ramping, defect characterization, root-cause analysis, process monitoring, RMA support, and process optimization. Uses electrical and inline data analysis, SPC, DOEs, and scripting to identify yield limiters, resolve integration issues, improve process margins, and support FEOL and BEOL technology development.

Develop and execute verification strategies for mixed-signal IP and FlexIC designs. Build testbench environments, interpret specifications, debug failures with digital and analog designers, and provide verification feedback. Produce reports and coverage statistics throughout the design flow while supporting multiple projects and tight deadlines. The role uses SystemVerilog, with UVM, formal verification, gate-level simulation, post-tapeout bring-up, and DFT/ATPG knowledge desirable.

Leads product-level wafer characterization and production-test activities, including RF and analogue test design, automated hardware and software test development, data analysis, measurement integrity assessment, and reporting. Manages a small engineering team, collaborates with cross-functional stakeholders, supports production-test strategy and limit setting, and presents characterization findings to technical and non-technical audiences.

Lead development, qualification, optimization, and transfer of advanced semiconductor back-end assembly processes into high-volume manufacturing. Responsibilities include die singulation, laser processing, wafer-on-frame debonding, advanced packaging, DOE, process characterization, SPC, NPI, technical problem solving, process documentation, and mentoring engineering teams.

Leads sustaining engineering for back-end semiconductor assembly, supporting wafer release through outgoing inspection. Responsibilities include maintaining process stability, improving yield and equipment effectiveness, resolving manufacturing issues, leading root-cause investigations and DOEs, managing SPC systems, supporting product qualification and new product introduction, and transitioning processes into volume manufacturing.

Leads Pragmatic Semiconductor’s European commercial strategy across IDM and Foundry businesses. Owns regional revenue, order intake, account growth, sales planning, pipeline development, forecasting, executive relationships, negotiations, and partner management. Drives NFC and RFID product adoption, converts technical engagements into funded development programs and wafer orders, and coordinates cross-functional teams across Marketing, Product, Engineering, and Operations. The role requires substantial European and international travel, with responsibility for aligning customer commitments with technical readiness and manufacturing capacity.

Pack and arrange external and internal shipments, prepare shipping documentation, coordinate courier collections, track goods in internal systems, monitor packing-material stock, safely store and transfer wafers, and provide Goods In absence cover. The role requires accuracy, organisation, collaboration, deadline management, and adherence to standard operating procedures in a warehouse or manufacturing environment.

Owns metal-oxide PVD process development, qualification, sustaining, and transfer to high-volume manufacturing. Leads optimization of deposition rate, stoichiometry, film stress, resistivity, uniformity, and particle performance. Drives root-cause investigations, SPC, process capability analysis, equipment qualification, change control, and cross-functional integration. Directly manages and mentors a small deposition engineering team while providing technical leadership on chamber troubleshooting, reactive sputtering, and process improvement.