Lead Process Sustaining Engineer (Back End)

Posted 7 Days Ago
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Durham, England, GBR
In-Office
Expert/Leader
Hardware • Semiconductor
The Role
Leads sustaining engineering for back-end semiconductor assembly, supporting wafer release through outgoing inspection. Responsibilities include maintaining process stability, improving yield and equipment effectiveness, resolving manufacturing issues, leading root-cause investigations and DOEs, managing SPC systems, supporting product qualification and new product introduction, and transitioning processes into volume manufacturing.
Summary Generated by Built In
Overview

We have an excellent opportunity in our Technology function for a Lead Process Sustaining Engineer to join our Back End/Assembly team. Based in Durham and reporting to the Principal Process Development Engineer, this is a key role which will provide technical leadership and drive manufacturing excellence across our Back End Operations as we grow our product porfolio.

You will be responsible for sustaining and continuously improving high-volume manufacturing processes, ensuring product quality, yield performance, equipment effectiveness, and operational efficiency. You will lead efforts to resolve complex process challenges, support product transfers, and collaborate with cross-functional teams to achieve manufacturing objectives that translate into ensuring stable and robust manufacturing processes.

We are looking for candidates with deep knowledge of Back End wafer fabrication processes, and the ability to work well in a cross-functional environment. You will be joining a key function at a critical time during our production ramp, and will therefore have a vital role to play in the company's success.

Visa sponsorship and relocation assistance will be available for the successful candidate, if required.

Key tasks
  • Provide engineering support for backend assembly from Wafer release on glass to outgoing quality inspection

  • Monitor process performance and maintain process stability across production lines

  • Investigate and resolve process-related manufacturing issues impacting yield, quality, cycle time, and productivity

  • Support daily production activities and ensure adherence to process specifications

  • Develop and maintain process documentation, operating procedures, and work instructions

  • Lead root cause investigations using structured problem-solving methodologies

  • Drive defect reduction and process capability improvement initiatives

  • Work closely with Equipment Engineering to improve equipment reliability and uptime

  • Support product qualification and manufacturing readiness activities

  • Assist with process characterisation and validation during new product introduction

  • Ensure successful transition from development to volume manufacturing

  • Monitor key process indicators and manufacturing metrics

  • Utilise statistical tools to analyse process performance and identify trends

  • Prepare technical reports, presentations, and recommendations for management

  • Maintain process control systems and Statistical Process Control (SPC) charts

Qualifications and training

You will ideally be educated to degree level in a field such as Engineering or Materials Science (or will possess equivalent industry experience)

Skills and experience
  • Excellent understanding of Back End processes (particularly die singulation, bonding/de-bonding and laser processes)

  • Understanding of how Front End process changes impact Back End qualification and reliability

  • Experience of devising and leading experiments, trials and DOEs

  • Strong understanding of SPC, how to monitor and identify trends and violations and resolutions

  • Excellent communication, reporting, and presentation abilities

  • Strong data analysis skills, and the ability to translate data into conclusions and recommendations

  • Experience using analytical software such as JMP

  • Strong organisational skills and ability to manage multiple tasks and priorities

  • Strong analytical skills with the ability to solve complex, multidimensional problems

Candidates who do not meet every requirement but feel their skills are a good fit for the role the role are encouraged to apply.

Pragmatic Semiconductor is committed to equity, equality, diversity, and inclusion; we strive to welcome everyone and create inclusive teams. We celebrate difference and encourage everyone to be themselves at work. Please let us know if you would like any adjustments to our application and interview process.

Skills Required

  • Degree in Engineering, Materials Science, or equivalent industry experience
  • Deep understanding of back-end semiconductor processes, particularly die singulation, bonding/de-bonding, and laser processes
  • Understanding of how front-end process changes affect back-end qualification and reliability
  • Experience devising and leading experiments, trials, and Design of Experiments
  • Strong understanding of Statistical Process Control, including monitoring trends, violations, and resolutions
  • Strong data analysis skills and ability to translate data into conclusions and recommendations
  • Experience using JMP or similar analytical software
  • Excellent communication, reporting, and presentation abilities
  • Strong organizational skills and ability to manage multiple priorities
  • Strong analytical and complex problem-solving skills
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The Company
HQ: Cambridge
274 Employees
Year Founded: 2010

What We Do

Pragmatic has developed an integrated circuit platform that doesn’t rely on silicon. Our revolutionary technology uses thin-film semiconductors to create flexible integrated circuits that are thinner than a human hair, and are significantly cheaper and faster to produce than silicon chips. This provides a compelling alternative for many mainstream electronics applications, as well as enabling new applications not possible with silicon. Pragmatic’s ultra-low-cost, ultra-thin, flexible integrated circuits make it possible to embed our chips into almost anything, bringing connectivity and intelligence to everyday objects. Example applications include radio frequency identification (RFID) and near field communications (NFC), where our chips cost less than a penny and allow these everyday objects to be given unique digital identities as well as interact with their environment. This brings game-changing benefits to the entire product lifecycle, including inventory reduction, traceability, counterfeit detection, proof of provenance, and customer interaction.

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